Publication

Dipole antenna and distributed MEMS phase shifter fully integrated in a single wafer process for beam steering applications

Mihai Adrian Ionescu, Paolo Giuseppe Dainesi
2010
Journal Articles

Abstract

This paper reports on the design and fabrication of a fully integrated antenna beam steering concept for airborne applications at 17 GHz. The system is based on a single wafer process including a dipole antenna, a balun and a 2-bit distributed MEMS phase shifter (in a 7 x 3 mm high-resistivity-silicon dice). To our knowledge, it is the first time that such integration has been done. First results of individual devices are reported and simulations of the whole concept are originally presented. (C) 2009 Elsevier B.V. All rights reserved.

Official source

https://infoscience.epfl.ch/entities/publication/6b348c1e-6187-42d8-b0fc-dcf43a626e91

About this result

This page is automatically generated and may contain information that is not correct, complete, up-to-date, or relevant to your search query. The same applies to every other page on this website. Please make sure to verify the information with EPFL's official sources.

Graph Chat

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

Mihai Adrian Ionescu, Paolo Giuseppe Dainesi
2010
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/6b348c1e-6187-42d8-b0fc-dcf43a626e91

About this result

Related concepts (25)

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.

Planar process

The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together. It is the primary process by which silicon integrated circuit chips are built. The process utilizes the surface passivation and thermal oxidation methods. The planar process was developed at Fairchild Semiconductor in 1959. The key concept is to view a circuit in its two-dimensional projection (a plane), thus allowing the use of photographic processing concepts such as film negatives to mask the projection of light exposed chemicals.

Wafer (electronics)

In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning.

Related publications (11)

Dipole antenna and distributed MEMS phase shifter fully integrated in a single wafer process for beam steering applications

Chat with Graph Search

Lithium-Tantalate-on-Fused Silica Mach-Zehnder Modulators

Silicon heterojunction solar cells on n- and p-type wafers with efficiencies above 20%

Amorphous silicon-based microchannel plates