Publication

Development of Electrical and Optical Packaging for Silicon Photonic MEMS

Niels Quack
2024

Abstract

We demonstrate a packaging approach to integrate electrical and optical connections in silicon photonic MEMS, utilizing a custom-designed silicon interposer for routing over 118 electrical connections and a 72 channel fiber array to couple to on-chip fiber grating couplers with minimal transmission loss at 1543 nm wavelength.

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Development of Electrical and Optical Packaging for Silicon Photonic MEMS

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