Field curvature correction in multichannel miniature imaging systems suited for wafer-level production

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An optical-delay-line assembly (1) comprises a substrate (2), an optical assembly (3), and a movement device (4). the optical assembly (3) is arranged on the substrate (2) and is configured to guide an optical signal (s1) generated from a source of electromagnetic waves (5), preferably from an optical input (6) of the substrate (2) to an optical output (7) of the substrate (2), along an optical path (p1). the movement device (4), when being exposed to energy, is configured to deform at least in the region o

Pancharatnam-Berry (PB) metasurfaces encode the geometric phase through the rotation of the meta-atom, which exhibits opposite phases and nearly equal conversion amplitudes in the two cross-polarized channels. This spin duality has long restricted PB metasurfaces to spin-symmetric responses with insufficient contrast for spin-selective operation. Here we experimentally demonstrate a regime in which the geometric phase is preserved while its spin duality is deliberately broken. By engineering the pillar-latt

Fabricating high-resolution grayscale patterns at the nanoscale remains a significant challenge, particularly on fused silica substrates. These grayscale patterns find extensive applications in optical devices such as optical gratings, diffraction optics, and transparent electronics in the semiconductor industry. Although thermal scanning probe lithography (T-SPL) enables high-resolution grayscale patterning on polyphthalaldehyde (PPA), it is a slow process and necessitates also transfer to a stable substra

Femtosecond laser exposure of fused silica combined with chemical etching has opened up new opportunities for three-dimensional freeform processing of micro-structures that can form complex micro-devices of silica, integrating optical, mechanical and/or fluidic functionalities. Here, we demontrate an expansion of this process with an additional fabrication step that enables the integration of three-dimensional embedded metallic structures out of useful engineering metals such as silver, gold, copper as well

IIn mobile imaging systems, the most difficult element to integrate is the objective lens. Here we present an intermediate approach between the costly traditional objectives and the low-resolution objectives inspired by the compound eyes of insects. Our multi-field approach uses a small number of optical channels each imaging a portion of the desired field of view. The full-field image is reconstructed digitally. The optics of each channel is kept simple for wafer-level fabrication and its size is sufficien

This paper presents a complete wafer level microfabrication process for the production of unimorph MEMS energy harvesters based on bulk PZT. Recently, piezoelectric harvesters designed to take advantage of the high quality piezoelectric properties of bulk PZT have been fabricated using local placement and bonding of individual PZT pieces and large proof masses at the chip level. With the process presented here, 16 piezoelectric energy harvesters have been fabricated in parallel at the wafer level by bonding

A new fabrication strategy is proposed to reduce the size of sensors based on inkjet-printed interdigitated electrodes (IDE). The process is compatible with fabrication at low temperature and can be applied to flexible organic foils. The new fabrication concept consists of the deposition of a thin dielectric layer of parylene-C onto the first electrodes comb prior to the printing of the second one. In this way, the combs are not longer on the same plane, preventing undesired short-circuits and solving the t

Silicon has been, and continues to be, the material support of integrated circuit (IC) technology-the enabling tool of one of the most impressive technological, industrial and social revolution of mankind. Silicon (both in monocrystalline and polycrystalline form as well as epitaxial silicon, silicon on insulator and silicon on nothing) has grown with IC technology for its ability to match the numerous and complex needs of microelectronics. In recent years, however, IC technology is experiencing problems of

Amperometric biosensors are complex systems and they require a combination of technologies for their development. The aim of the present work is to exploit existing technologies for new purposes in order to develop nanostructured biosensors for the real-time detection of multiple metabolites in cell culture flasks. The fabrication of five Au working electrodes onto silicon substrate is achieved with CMOS compatible microtechnology. Each working electrode presents an area of 0.25 mm2, so structura

The mechanisms and environmental influences that cause photovoltaic modules performance degradation are poorly understood, but it is well known that water vapour is deeply implicated in the degradation process. Indeed, some layers and interfaces of thin film modules can be moisture sensitive and depending on the processing conditions, they degrade after exposure to damp heat conditions (85°C, 85% relative humidity) [1]. Transparent conductive oxides (TCO), as used in CIGS or thin silicon film cells play a p

Photovoltaic cells have been dominated so far by solid state p-n junction devices made from silicon or gallium arsenide wavers or thin film embodiments based on amorphous silicon, CdTe and copper indium gallium diselenide (CIGS) profiting from the experience and material availability of the semiconductor industry. Recently there has been a surge of interest for devices that are based on nanoscale inorganic or organic semiconductors commonly referred to as “bulk” junctions due to their interconnected three-d

This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) and high self-resonance frequency (SRF) devices using quartz insulating substrates and thick high-conductivity copper lines. Inductors are key devices in RF circuits that, when fabricated on traditional semiconductor substrates, suffer from poor RF performances due to thin metallization and substrate related losses. Many previous works revealed that RF performances are strongly dependent on the limited metallizat

We have developed hybrid AFM probes with SU-8 polymer body and full platinum and tungsten cantilever and tip. The fabrication process uses surface micromachining of a (100) silicon wafer. The metal (platinum or tungsten) is sputter deposited in oxidation sharpened moulds, giving a final tip sharpness smaller than 20 nm. A SU-8 body is subsequently formed. The release is either done by a wet back-side or dry top-side process. The measured hardness of the tungsten and platinum film values 14.8 GPa and 7.3 GPa

This thesis deals with the development of microfabrication technologies based on photoplastic structuring by lithographic and molding techniques. These technologies, combined with an original releasing method, allow for the simple fabrication of pseudo three-dimensional, soft, photoplastic microstructures with features and shapes that are difficult to obtain with standard micro-machining. The photoplastic material used is the SU-8 photoresist, a material that is used increasingly in the growing field of mic

An encapsulation device, designed on the basis of the laminar jet break-up technique, is characterized for cell immobilization with different types of alginate. The principle of operation of the completely sterilizable encapsulator, together with techniques for the continuous prodn. of beads from 250 mm to 1 mm in diam., with a size distribution below 5%, at a flow rate of 1-15 mL/min, is described. A modification of the device, to incorporate an electrostatic potential between the alginate droplets and an

A single failure in a communication network may trigger many alarms. When the communication network uses optical fibres as transmission medium and increases its capacity by using Wavelength Division Multiplexing (WDM), the number of alarms and the difficulty to locate the failure are considerably higher. In this case, a single failure may interrupt several channels which causes a large information loss. We propose an Alarm Filtering Algorithm (AFA) for the fault management of an optical network that support

In this paper, we describe a simple logic. The logic uses the notion of channels that are generalisations of communication links with various security properties. The abstract nature of channels enables us to treat the protocol at a higher abstraction level than do most of the known logics for authentication, and thus, we can address the higher level functional properties of the system, without having to be concerned with the problems of the actual implementation. The major advantage of the proposed logic i

The paper reviews different aspects of deposition, integration, and device fabrication of PbZrxTi1-xO3 (PZT) films for application in micromechanical systems. The deposition of such films and the principal processes for their integration onto silicon substrates are now fairly well mastered. Current efforts concentrate on tailoring the film properties for the various applications, and on optimization of the device designs and patterning processes. Current work on an ultrasonic micromotor and a pyroelectric I

Platinum silicide films are widely used in silicon devices for ohmic and Schottky contacts. It has been demonstrated in the recent years that Schottky barriers employing ultra-thin platinum silicide films (thickness < 10 nm) are useful for photodetection in the near infrared. We have studied the formation of thin platinum silicide films and their electrical properties as a function of the annealing temperature in presence of an interfacial native silicon oxide layer and with plasma etching damage on the Si

An efficient, electrically conductive, chemical barrier for the integration of piezoelectric Pb(Zr,Ti)O3 (PZT) films on reactive metal substrates has been developed, opening new possibilities for PZT integration on micromechanical and semiconductor devices, Very reactive zir conium films have been taken in order to test the quality of the specially designed RuO2/Cr buffer under the condition of in situ sputter deposition of PZT at 600 degrees C. The PZT/RuO2 interface was found to be free of intermediate ph

Field curvature correction in multichannel miniature imaging systems suited for wafer-level production

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Optical-delay-line assembly

Observation of Spin-Duality Breaking in Pancharatnam-Berry Metasurfaces

Nanoimprint stamp fabrication by combination of T-SPL and dry etching

Femtosecond laser assisted 3-dimensional freeform fabrication of metal microstructures in fused silica

Multiple-Field Approach for Aberration Correction in Miniature Imaging Systems Based on Wafer-Level Production

Wafer Level Fabrication of Vibrational Energy Harvesters using Bulk PZT Sheets

Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer

Nanoengineered Silicon: Technology and Applications

New Technologies for Nanobiosensing and their Applications to Real-Time Monitoring

DAMP HEAT STABILITY OF TRANSPARENT CONDUCTIVE ZINC OXIDES: ROLE OF ENCAPSULANTS AND PROTECTIVE LAYERS

Recent Applications of Nanoscale Materials: Solar Cells

High quality factor copper inductors integrated in deep dry-etched quartz substrates

Full tungsten and platinum nanoprobes for electrically conducting scanning probe methods

New photoplastic fabrication techniques and devices based on high aspect ratio photoresist

Characterization of an encapsulation device for the production of monodisperse alginate beads for cell immobilization

Fault Localization at the WDM Layer

A Simple Logic for Authentication Protocol Design

PZT thin films for micro sensors and actuators

Formation and properties of nanometer-thick platinum silicide layers

Pb(Zr,Ti)O3 thin films on zirconium membranes for micromechanical applications