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Direct fabrication of NIL stamps using Stencil Lithography

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Doping challenges and pathways to industrial scalability of III–V nanowire arrays

Anna Fontcuberta i Morral, Wonjong Kim, Lucas Güniat, Valerio Piazza

Semiconductor nanowires (NWs) have been investigated for decades, but their application into commercial products is still difficult to achieve, with triggering causes related to the fabrication cost and structure complexity. Dopant control at the nanoscale ...

2021

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

Nico de Rooij, Terunobu Akiyama, Peter Van der Wal, Sebastian Gautsch, Yexian Wu

In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reacti ...

IEEE2013

Integration of MEMS in Silicon Photonics

Alain Yuji Takabayashi

Like integrated electronics, integrated photonics such as Silicon Photonics benefit from increased device-density on a single chip. Silicon is an excellent material for integrated photonics because its high refractive index allows devices to be made small, ...

EPFL2021

Fabrication of Free-Standing Plasmonic Nanoantennas with Application for Optical Break Junctions

Olivier Martin, Christian Santschi, Banafsheh Abasahl

We report the fabrication of plasmonic nanoantennas with dimensions in the 200 - 300 nm range, suspended across a nano-undercut, which will be used for the investigation of the optical properties of break junctions. Nanochannels, fabricated using e-beam li ...

Ieee2012

Fabrication of zipping electrostatic actuators incorporating inkjet-printed layers

Herbert Shea, Samuel Rosset, Giulio Grasso

Zipping electrostatic actuators operate by bending flexible electrodes using electrostatic forces. This principle allows the use of a wide range of dielectric and conductive materials. Additive Manufacturing (AM) techniques can be used to fabricate these a ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Broadband Compact Single-Pole Double-Throw Silicon Photonic MEMS Switch

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Photonic Integrated Circuits (PICs) benefit from the technology advances in the semiconductor industry to incorporate an ever-increasing number of photonic components on a single chip to create large-scale photonic integrated circuits. We here present a br ...

Institute of Electrical and Electronics Engineers2021

Fabrication and applications of AuAg alloy metasurfaces and hybrid metal dielectric nanoantennas

Debdatta Ray

The most prevalent materials used in the field of plasmonics are Au and Ag. However, for the past few years, the plasmonic community has also been looking for alternative materials that have lower losses than Au and higher stability than Ag. This thesis is ...

EPFL2021

Self-Actuated Polymer-Based Cantilevers With Sharp Silicon Tips For High-Speed Atomic Force Microscopy

Georg Fantner, Santiago Harald Andany, Nahid Hosseini, Matthias Neuenschwander

High-speed atomic force microscopy has thus far largely been limited to the use of small cantilevers in liquid, but the technique would greatly profit areas of nanotechnology that require the use of larger probes in air. We present polymer-based cantilever ...

IEEE2021

Nonlinear plasmonics with monocrystalline gold

Sergejs Boroviks

Plasmonic nanostructures allow to controllably enhance linear and nonlinear light-matter interactions by concentrating the electromagnetic fields at the scales below the diffraction limit. This feature is highly desired for many applications, e.g. bio- and ...

2021

PyroMEMS: Improved Fabrication Methods and Ignition Reliability

David de Koninck

Generating large force/displacement actuators at the millimeter and sub-millimeter scales remains an important challenge for microsystems engineers. One promising solution is to integrate high-energy density solid propellant fuels in microsystems (pyroMEMS ...

EPFL2012

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

Exploring ferroelectricity in HfO2-based thin films by tackling application-relevant challenges

Matteo Cavalieri

Ferroelectric materials offer a broad range of application-relevant properties, including spontaneous polarization switchable by electric field. Archetypical representatives of this class of materials are perovskites, currently used in applications ranging ...

EPFL2021

Multi-gate Si nanowire MOSFETs : fabrication, strain engineering and transport analysis

Mohammad Najmzadeh

Multi-gate devices e.g. gate-all-around (GAA) Si nanowires and FinFETs are promising can- didates for aggressive CMOS downscaling. Optimum subthreshold slope, immunity against short channel effect and optimized power consumption are the major benefits of s ...

EPFL2012

A novel approach to dielectrophoresis using carbon electrodes

Philippe Renaud, Rodrigo Martinez Duarte

Carbon-electrode dielectrophoresis (carbon-DEP) is demonstrated here as an alternative to more traditional DEP techniques. Carbon-DEP combines advantages of metal-electrode and insulator-based DEP by using low-cost fabrication techniques and low voltages f ...

Wiley-Blackwell2011