Publications related to Direct fabrication of NIL stamps using Stencil Lithography

Additively manufactured stretchable zipping electrostatic actuators

The use of soft and stretchable materials allows the development of adaptive robotic systems and human-machine interfaces that are more natural and comfortable to interact with. One of the application fields that benefits the most from these compliant mate ...

EPFL2024

Advanced Silicon and SWIR Single-Photon Avalanche Diodes: Design, Simulation, and Characterization

Ekin Kizilkan

Low-level light detection with high spatial and timing accuracy is a growing area of interest by virtue of applications such as light detection and ranging (LiDAR), biomedical imaging, time-resolved Raman spectroscopy, and quantum applications. Single-phot ...

EPFL2024

Silicon microresonator arrays: A comprehensive study on fabrication techniques and pH-controlled stress-induced variations in cantilever stiffness

Luis Guillermo Villanueva Torrijo, Annalisa De Pastina

We introduce a detailed design and fabrication process of Silicon microcantilever arrays for biomolecular detection in liquid environment, utilized with laser readout. We present typical fabrication problems and provide related solutions to obtain high qua ...

Elsevier2024

A multi-material robotic finger with integrated proprioceptive and tactile capabilities produced with a circular process

Antonia Georgopoulou Papadonikolaki, Josephine Anna Eleanor Hughes, Kai Christian Junge

When developing or designing biomimetic robotic fingers with rigid and soft components and integrated sensors, fabrication is often a bottle-neck when assembling and casting processing techniques are used. This study introduces a thermoplastic multi-materi ...

IEEE2023

Fabrication of Single-Crystalline InSb-on-Insulator by Rapid Melt Growth

Anna Fontcuberta i Morral, Nicholas Paul Morgan, Heera Menon

InSb has the smallest bandgap and highest electron mobility among III-V semiconductors and is widely used for photodetectors and high-frequency electronic applications. Integration of InSb directly on Si would drastically reduce the fabrication cost and en ...

Wiley2021

Doping challenges and pathways to industrial scalability of III–V nanowire arrays

Anna Fontcuberta i Morral, Lucas Güniat, Wonjong Kim, Valerio Piazza

Semiconductor nanowires (NWs) have been investigated for decades, but their application into commercial products is still difficult to achieve, with triggering causes related to the fabrication cost and structure complexity. Dopant control at the nanoscale ...

2021

Fabrication of zipping electrostatic actuators incorporating inkjet-printed layers

Samuel Rosset, Herbert Shea, Giulio Grasso

Zipping electrostatic actuators operate by bending flexible electrodes using electrostatic forces. This principle allows the use of a wide range of dielectric and conductive materials. Additive Manufacturing (AM) techniques can be used to fabricate these a ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Exploring ferroelectricity in HfO2-based thin films by tackling application-relevant challenges

Matteo Cavalieri

Ferroelectric materials offer a broad range of application-relevant properties, including spontaneous polarization switchable by electric field. Archetypical representatives of this class of materials are perovskites, currently used in applications ranging ...

EPFL2021

Stretchable Kirigami Components for Composite Meso-Scale Robots

Jamie Paik, Amir Firouzeh, Tatsuya Higashisaka

Layer-by-layer manufacturing of composite mechanisms allows fast and cost-effective fabrication of customized robots in millimeter and centimeter scales which is promising for research fields that rely on frequent and numerous physical iterations. Due to t ...

2020

Thermomechanical Nanocutting of 2D Materials

Giovanni Boero, Jürgen Brugger, Samuel Tobias Howell, Xia Liu, Ana Conde Rubio

Atomically thin materials, such as graphene and transition metal dichalcogenides, are promising candidates for future applications in micro/nanodevices and systems. For most applications, functional nanostructures have to be patterned by lithography. Devel ...

Wiley2020

Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Elison de Nazareth Matioli, Reza Soleiman Zadeh Ardebili, Georgios Kampitsis, Remco Franciscus Peter van Erp, Luca Nela

In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...

IEEE2020

Semiconductor Nanowires: To Grow or Not to Grow?

Anna Fontcuberta i Morral

Semiconductor nanowires have demonstrated exciting properties for nanophotonics, sensors, energy technologies and end-of-roadmap and beyond-roadmap electronic devices. Fabrication schemes for nanowires are varied, but they fall into three general categorie ...

2019

Three-Dimensional Crystalline and Homogeneous Metallic Nanostructures Using Directed Assembly of Nanoparticles

Hatice Altug, Arif Engin Cetin, Jun Huang

Directed assembly of nano building blocks offers a versatile route to the creation of complex nanostructures with unique properties. Bottom-up directed assembly of nanoparticles have been considered as one of the best approaches to fabricate such functiona ...

2014

Large Arrays Of Inkjet-Printed Mems Microbridges On Foil

Nico de Rooij, Francisco Molina Lopez, Danick Briand

This works describes the fabrication process of an array of printed MEMS microbridges on polymeric foil, performed in only four easy steps. Each functional material was deposited exclusively by inkjet-printing technique, compatible with large-area fabricat ...

IEEE2014

In-plane fabrication of insulated gold-tip probes for electrochemical and force spectroscopy molecular experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

A new and versatile fabrication process of insulated gold tip probes for atomic force microscopy (AFM) is presented by Wu et al. (In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments, in: 2013 IEEE 26th International C ...

Elsevier2014

Encapsulated Low Frequency Vibrating Body Field Effect Resonator

Marion Hermersdorf

Resonators for time and frequency reference applications are essential elements found in most electronic devices surrounding us. The continuous minimization and ubiquitous distribution of such electronic devices and circuits demands for resonators of small ...

EPFL2013

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reacti ...

IEEE2013

Fabrication of Free-Standing Plasmonic Nanoantennas with Application for Optical Break Junctions

Christian Santschi, Olivier Martin, Banafsheh Abasahl

We report the fabrication of plasmonic nanoantennas with dimensions in the 200 - 300 nm range, suspended across a nano-undercut, which will be used for the investigation of the optical properties of break junctions. Nanochannels, fabricated using e-beam li ...

Ieee2012

PyroMEMS: Improved Fabrication Methods and Ignition Reliability

David de Koninck

Generating large force/displacement actuators at the millimeter and sub-millimeter scales remains an important challenge for microsystems engineers. One promising solution is to integrate high-energy density solid propellant fuels in microsystems (pyroMEMS ...

EPFL2012

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012