Publication

Coated, light-transmitting or reflecting substrate, used as optical component or window, e.g. lens, mirror or windscreen, has (per)fluoroalkylsilane coating produced by plasma etching, hydration, drying and gas phase deposition

Patrik Willi Hoffmann, Gerit Kulik
2002
Patents

Abstract

A method for the gas phase deposition of partially fluorinated or perfluorinated alkyl silanes onto a substrate in a reaction chamber includes cleaning the substrate, hydrating the substrate with steam, drying the substrate and silanization of the substrate by deposition of the alkyl silane from the gas phase. The cleaning of the substrate is a plasma etching process and the hydration occurs directly after the plasma etching.

Official source

https://infoscience.epfl.ch/entities/publication/434c0686-79a1-49c5-afbf-a5b75e4d99b0

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Patrik Willi Hoffmann, Gerit Kulik
2002
Patents

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/434c0686-79a1-49c5-afbf-a5b75e4d99b0

About this result

Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Plasma etching

Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral (atoms and radicals). During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma.

Related publications (32)

Coated, light-transmitting or reflecting substrate, used as optical component or window, e.g. lens, mirror or windscreen, has (per)fluoroalkylsilane coating produced by plasma etching, hydration, drying and gas phase deposition

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