Metal fabricationMetal fabrication is the creation of metal structures by cutting, bending and assembling processes. It is a value-added process involving the creation of machines, parts, and structures from various raw materials. Typically, a fabrication shop bids on a job, usually based on engineering drawings, and if awarded the contract, builds the product. Large fab shops employ a multitude of value-added processes, including welding, cutting, forming and machining. As with other manufacturing processes, both human labor and automation are commonly used.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
PolymerizationIn polymer chemistry, polymerization (American English), or polymerisation (British English), is a process of reacting monomer molecules together in a chemical reaction to form polymer chains or three-dimensional networks. There are many forms of polymerization and different systems exist to categorize them. In chemical compounds, polymerization can occur via a variety of reaction mechanisms that vary in complexity due to the functional groups present in the reactants and their inherent steric effects.
Induction sealingInduction sealing is the process of bonding thermoplastic materials by induction heating. This involves controlled heating an electrically conducting object (usually aluminum foil) by electromagnetic induction, through heat generated in the object by eddy currents. Induction sealing is used in many types of manufacturing. In packaging it is used for package fabrication such as forming tubes from flexible materials, attaching plastic closures to package forms, etc.
Multi-project wafer serviceMulti-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share mask and microelectronics wafer fabrication cost between several designs or projects. With the MPC arrangement, one chip is a combination of several designs and this combined chip is then repeated all over the wafer during the manufacturing. MPC arrangement produces typically roughly equal number of chip designs per wafer.
Semiconductor consolidationSemiconductor consolidation is the trend of semiconductor companies collaborating in order to come to a practical synergy with the goal of being able to operate in a business model that can sustain profitability. Since the rapid adoption of the modern day chip in the 1960s, most companies involved in producing semiconductors were extremely vertically integrated. Semiconductor companies owned and operated their own fabrication plants and also the processing technologies that facilitated the creation of the chips.
Aluminium foilAluminium foil (or aluminum foil in North American English; often informally called tin foil) is aluminium prepared in thin metal leaves. The foil is pliable, and can be readily bent or wrapped around objects. Thin foils are fragile and are sometimes laminated with other materials such as plastics or paper to make them stronger and more useful. Annual production of aluminium foil was approximately in Europe and in the U.S. in 2003. Approximately 75% of aluminium foil is used for packaging of foods, cosmetics, and chemical products, and 25% is used for industrial applications (e.
Printed electronicsPrinted electronics is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. By electronic-industry standards, these are low-cost processes. Electrically functional electronic or optical inks are deposited on the substrate, creating active or passive devices, such as thin film transistors; capacitors; coils; resistors.
Integrated passive devicesIntegrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear.
HydrofoilA hydrofoil is a lifting surface, or foil, that operates in water. They are similar in appearance and purpose to aerofoils used by aeroplanes. Boats that use hydrofoil technology are also simply termed hydrofoils. As a hydrofoil craft gains speed, the hydrofoils lift the boat's hull out of the water, decreasing drag and allowing greater speeds. The hydrofoil usually consists of a winglike structure mounted on struts below the hull, or across the keels of a catamaran in a variety of boats (see illustration).
Remote sensingRemote sensing is the acquisition of information about an object or phenomenon without making physical contact with the object, in contrast to in situ or on-site observation. The term is applied especially to acquiring information about Earth and other planets. Remote sensing is used in numerous fields, including geophysics, geography, land surveying and most Earth science disciplines (e.g. exploration geophysics, hydrology, ecology, meteorology, oceanography, glaciology, geology); it also has military, intelligence, commercial, economic, planning, and humanitarian applications, among others.
Fused filament fabricationFused filament fabrication (FFF), also known as fused deposition modeling (with the trademarked acronym FDM), or filament freeform fabrication, is a 3D printing process that uses a continuous filament of a thermoplastic material. Filament is fed from a large spool through a moving, heated printer extruder head, and is deposited on the growing work. The print head is moved under computer control to define the printed shape.
