Publication

Three-dimensional Microstructuring of Chalcogenide Glass by Femtosecond Laser Exposure and Subsequent Chemical Etching

Yves Bellouard
2026

Abstract

Chalcogenide glass has the broadest reported transparency in the infrared, making them particularly attractive for spectroscopy and infrared imagery. Yet, it remains a difficult material to shape in arbitrary form. In this paper, we explore the combination of femtosecond laser-exposure and subsequent chemical etching steps to produce arbitrary 3D shapes out of a chalcogenide glass substrate coated with a SiO 2 thin film. In this context, we discuss how laser parameters locally influence the etching rate.

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Yves Bellouard
2026

Abstract

Official source

Related concepts (31)

Etching (microfabrication)

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.

MEMS

MEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.

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Three-dimensional Microstructuring of Chalcogenide Glass by Femtosecond Laser Exposure and Subsequent Chemical Etching

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