MicrofabricationMicrofabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades microelectromechanical systems (MEMS), microsystems (European usage), micromachines (Japanese terminology) and their subfields, microfluidics/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems) have re-used, adapted or extended microfabrication methods.
BrittlenessA material is brittle if, when subjected to stress, it fractures with little elastic deformation and without significant plastic deformation. Brittle materials absorb relatively little energy prior to fracture, even those of high strength. Breaking is often accompanied by a sharp snapping sound. When used in materials science, it is generally applied to materials that fail when there is little or no plastic deformation before failure. One proof is to match the broken halves, which should fit exactly since no plastic deformation has occurred.
Etching (microfabrication)Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.
Strength of materialsThe field of strength of materials (also called mechanics of materials) typically refers to various methods of calculating the stresses and strains in structural members, such as beams, columns, and shafts. The methods employed to predict the response of a structure under loading and its susceptibility to various failure modes takes into account the properties of the materials such as its yield strength, ultimate strength, Young's modulus, and Poisson's ratio.
Naval artilleryNaval artillery is artillery mounted on a warship, originally used only for naval warfare and then subsequently used for more specialized roles in surface warfare such as naval gunfire support (NGFS) and anti-aircraft warfare (AAW) engagements. The term generally refers to tube-launched projectile-firing weapons and excludes self-propelled projectiles such as torpedoes, rockets, and missiles and those simply dropped overboard such as depth charges and naval mines. The idea of ship-borne artillery dates back to the classical era.
MicrolithographyMicrolithography is a general name for any manufacturing process that can create a minutely patterned thin film of protective materials over a substrate, such as a silicon wafer, in order to protect selected areas of it during subsequent etching, deposition, or implantation operations. The term is normally used for processes that can reliably produce features of microscopic size, such as 10 micrometres or less. The term nanolithography may be used to designate processes that can produce nanoscale features, such as less than 100 nanometres.
DuctilityDuctility is a mechanical property commonly described as a material's amenability to drawing (e.g. into wire). In materials science, ductility is defined by the degree to which a material can sustain plastic deformation under tensile stress before failure. Ductility is an important consideration in engineering and manufacturing. It defines a material's suitability for certain manufacturing operations (such as cold working) and its capacity to absorb mechanical overload.
CeramographyCeramography is the art and science of preparation, examination and evaluation of ceramic microstructures. Ceramography can be thought of as the metallography of ceramics. The microstructure is the structure level of approximately 0.1 to 100 μm, between the minimum wavelength of visible light and the resolution limit of the naked eye. The microstructure includes most grains, secondary phases, grain boundaries, pores, micro-cracks and hardness microindentations.
FractureFracture is the separation of an object or material into two or more pieces under the action of stress. The fracture of a solid usually occurs due to the development of certain displacement discontinuity surfaces within the solid. If a displacement develops perpendicular to the surface, it is called a normal tensile crack or simply a crack; if a displacement develops tangentially, it is called a shear crack, slip band or dislocation. Brittle fractures occur without any apparent deformation before fracture.
Fracture toughnessIn materials science, fracture toughness is the critical stress intensity factor of a sharp crack where propagation of the crack suddenly becomes rapid and unlimited. A component's thickness affects the constraint conditions at the tip of a crack with thin components having plane stress conditions and thick components having plane strain conditions. Plane strain conditions give the lowest fracture toughness value which is a material property.
Composite materialA composite material (also called a composition material or shortened to composite, which is the common name) is a material which is produced from two or more constituent materials. These constituent materials have notably dissimilar chemical or physical properties and are merged to create a material with properties unlike the individual elements. Within the finished structure, the individual elements remain separate and distinct, distinguishing composites from mixtures and solid solutions.
MetallographyMetallography is the study of the physical structure and components of metals, by using microscopy. Ceramic and polymeric materials may also be prepared using metallographic techniques, hence the terms ceramography, plastography and, collectively, materialography. The surface of a metallographic specimen is prepared by various methods of grinding, polishing, and etching. After preparation, it is often analyzed using optical or electron microscopy. Using only metallographic techniques, a skilled technician can identify alloys and predict material properties.
GunpowderGunpowder, also commonly known as black powder to distinguish it from modern smokeless powder, is the earliest known chemical explosive. It consists of a mixture of sulfur, carbon (in the form of charcoal) and potassium nitrate (saltpeter). The sulfur and carbon act as fuels while the saltpeter is an oxidizer. Gunpowder has been widely used as a propellant in firearms, artillery, rocketry, and pyrotechnics, including use as a blasting agent for explosives in quarrying, mining, building pipelines and road building.
SuperalloyA superalloy, or high-performance alloy, is an alloy with the ability to operate at a high fraction of its melting point. Key characteristics of a superalloy include mechanical strength, thermal creep deformation resistance, surface stability, and corrosion and oxidation resistance. The crystal structure is typically face-centered cubic (FCC) austenitic. Examples of such alloys are Hastelloy, Inconel, Waspaloy, Rene alloys, Incoloy, MP98T, TMS alloys, and CMSX single crystal alloys.
Soil consolidationSoil consolidation refers to the mechanical process by which soil changes volume gradually in response to a change in pressure. This happens because soil is a two-phase material, comprising soil grains and pore fluid, usually groundwater. When soil saturated with water is subjected to an increase in pressure, the high volumetric stiffness of water compared to the soil matrix means that the water initially absorbs all the change in pressure without changing volume, creating excess pore water pressure.
Event (particle physics)In particle physics, an event refers to the results just after a fundamental interaction takes place between subatomic particles, occurring in a very short time span, at a well-localized region of space. Because of the uncertainty principle, an event in particle physics does not have quite the same meaning as it does in the theory of relativity, in which an "event" is a point in spacetime which can be known exactly, i.e., a spacetime coordinate.
SubsidenceSubsidence is a general term for downward vertical movement of the Earth's surface, which can be caused by both natural processes and human activities. Subsidence involves little or no horizontal movement, which distinguishes it from slope movement. Processes that lead to subsidence include dissolution of underlying carbonate rock by groundwater; gradual compaction of sediments; withdrawal of fluid lava from beneath a solidified crust of rock; mining; pumping of subsurface fluids, such as groundwater or petroleum; or warping of the Earth's crust by tectonic forces.
Cross section (physics)In physics, the cross section is a measure of the probability that a specific process will take place when some kind of radiant excitation (e.g. a particle beam, sound wave, light, or an X-ray) intersects a localized phenomenon (e.g. a particle or density fluctuation). For example, the Rutherford cross-section is a measure of probability that an alpha particle will be deflected by a given angle during an interaction with an atomic nucleus. Cross section is typically denoted σ (sigma) and is expressed in units of area, more specifically in barns.
