Publication

Oblique Powder Blasting for Three-dimensional Micromachining of Brittle Materials

Martinus Adela Maria Gijs, Abdeljalil Sayah
2001
Journal Articles

Abstract

We present oblique powder blasting as a three-dimensional micromachining technology for brittle materials. Powder blasting is a microfabrication process, based on the use of a pressurised air beam containing eroding Al2O3 particles. By varying the angle of incidence of the incoming particles to a substrate, covered by a mask, one can exploit the oblique slopes of micropatterned holes and mask underetching phenomena to generate new options for three-dimensional microstructuring. We have identified and quantified the role of secondary rebounding particles in mask underetching.

Official source

https://infoscience.epfl.ch/entities/publication/1b152994-de92-4ba6-be0c-accf500b43ef

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Martinus Adela Maria Gijs, Abdeljalil Sayah
2001
Journal Articles

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/1b152994-de92-4ba6-be0c-accf500b43ef

About this result

Related concepts (18)

Microfabrication

Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades microelectromechanical systems (MEMS), microsystems (European usage), micromachines (Japanese terminology) and their subfields, microfluidics/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems) have re-used, adapted or extended microfabrication methods.

Brittleness

A material is brittle if, when subjected to stress, it fractures with little elastic deformation and without significant plastic deformation. Brittle materials absorb relatively little energy prior to fracture, even those of high strength. Breaking is often accompanied by a sharp snapping sound. When used in materials science, it is generally applied to materials that fail when there is little or no plastic deformation before failure. One proof is to match the broken halves, which should fit exactly since no plastic deformation has occurred.

Etching (microfabrication)

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.

Related publications (2)

Oblique Powder Blasting for Three-dimensional Micromachining of Brittle Materials

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