Publication

Stabilizing the Chemistry of NiOx in Perovskite Solar Cells to Pass the Damp Heat Test

Christophe Ballif, Mounir Driss Mensi
2025

Abstract

NiOx is widely used as a hole transport material in perovskite solar cells (PSCs). This wide band gap p-type material is conveniently deposited via high throughput RF-sputtering, making it suitable for the industrialization of PSCs. Nonetheless, for the cells to pass accelerated degradation tests such as the IEC 61215 damp heat (DH) test, the chemistry of the NiOx film should remain constant at elevated temperaturs to preserve its optoelectronic properties. This study emphasizes that structural defects resulting from Ni vacancies in NiOx lead to significant degradation of the PSCs after just a few hours of exposure to elevated temperatures (85 °C). We introduce here an approach to fine-tune the chemistry of the NiOx film by adjusting the gas flow during sputtering deposition and by incorporating Cs. Through this control on the chemistry of the layer, the optimized NiOx-based PSCs exhibit remarkable stability, with devices passing 5 times the IEC 61215 norm (

Official source

https://infoscience.epfl.ch/entities/publication/089c9283-d910-4329-94b3-cb3c84ad4925

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Christophe Ballif, Mounir Driss Mensi
2025

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/089c9283-d910-4329-94b3-cb3c84ad4925

About this result

Related concepts (32)

Perovskite solar cell

A perovskite solar cell (PSC) is a type of solar cell that includes a perovskite-structured compound, most commonly a hybrid organic–inorganic lead or tin halide-based material as the light-harvesting active layer. Perovskite materials, such as methylammonium lead halides and all-inorganic cesium lead halide, are cheap to produce and simple to manufacture. Solar-cell efficiencies of laboratory-scale devices using these materials have increased from 3.8% in 2009 to 25.

Sputtering

In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and can be an unwelcome source of wear in precision components. However, the fact that it can be made to act on extremely fine layers of material is utilised in science and industry—there, it is used to perform precise etching, carry out analytical techniques, and deposit thin film layers in the manufacture of optical coatings, semiconductor devices and nanotechnology products.

Sputter deposition

Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).

Related publications (32)

Stabilizing the Chemistry of NiOx in Perovskite Solar Cells to Pass the Damp Heat Test

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