Wolfgang Amadeus Vitale

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Related publications (29)

Ultra Fine-Pitch TSV Technology for Ultra-Dense High-Q RF Inductors

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Wolfgang Amadeus Vitale, Josef Weber

We demonstrate that fine-pitch TSV technology can be exploited to fabricate micro-inductors on high resistivity substrate, with record-high inductance per area and preserving their performance at GHz frequencies. We report an extensive experimental study o ...

2015

Fine Pitch 3D-TSV Based High Frequency Components for RF MEMS Applications

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Wolfgang Amadeus Vitale, Josef Weber

The development of interconnections suitable for radio- frequency (RF) and millimeter-wave (mm-wave) applications is of foremost importance for the feasibility of high-quality substrate-integrated devices. For this purpose, we introduce and validate the te ...

2015

Tunable Capacitors and Microwave Filters Based on Vanadium Dioxide Metal-Insulator Transition

Mihai Adrian Ionescu, Josef Andreas Schuler, Montserrat Fernandez-Bolanos Badia, Antonio Paone, Clara-Fausta Moldovan, Wolfgang Amadeus Vitale

We report the fabrication, modeling and characterization of novel microwave tunable capacitors based on the metal-insulator transition (MIT) of Vanadium Dioxide (VO2). We present the advantages of VO2-based capacitors over alternative technologies for micr ...

2015

Steep slope VO2 switches for wide-band (DC-40 GHz) reconfigurable electronics

Mihai Adrian Ionescu, Wladyslaw Grabinski, Andreas Schueler, Montserrat Fernandez-Bolanos Badia, Antonio Paone, Wolfgang Amadeus Vitale, Antonios Bazigos

IEEE2014

Growth optimization of vanadium dioxide films on SiO2/Si substrates

Mihai Adrian Ionescu, Andreas Schueler, Antonio Paone, Clara-Fausta Moldovan, Wolfgang Amadeus Vitale

2014

Tungsten Through Silicon Vias for 3D high quality factor embedded RF MEMS inductors

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Wolfgang Amadeus Vitale, Josef Weber

2013

RF MEMS power sensors for ultra-low power wake-up circuit applications

Catherine Dehollain, Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Wolfgang Amadeus Vitale, Antonios Bazigos

Power savings requirements in wake-up circuits and RFID applications can greatly benefit from the emerging RF MEM technology. In this paper we report an RF MEM power sensor that can simultaneously offer significant power savings and co-integration with wak ...

2013

High-Q 3D Embedded Inductors using TSV for RF MEMS Tunable Bandpass Filters (4.65-6.8 GHz)

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Wolfgang Amadeus Vitale

IEEE2012

Self-Assembled Nano-Electro-Mechanical Tri-state Carbon Nanotube Switches for Reconfigurable Integrated Circuits

Mihai Adrian Ionescu, Ji Cao, Wolfgang Amadeus Vitale

We report, for the first time, self-assembled cantilever and clamped-clamped tri-state carbon nanotube (T-CNT) nano-electro-mechanical (NEM) switches with sub-100 nm air-gap dual lateral gates. Unlike conventional bi-state CNT switches, the T-CNT NEM switc ...

Ieee2012

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