Publications by Martino Ruggiero

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The multicore revolution and the ever-increasing complexity of computing systems is dramatically changing system design, analysis and programming of computing platforms. Future architectures will feature hundreds to thousands of simple processors and on-ch ...

The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is responsible for temperature driven performance deterioration of the electronic systems Hot spots with power densities typically rising up to 250 W/cm2 are not ac ...

Server consolidation plays a key role to mitigate the continuous power increase of datacenters. The recent advent of scale-out applications (e.g., web search, MapReduce, etc.) necessitate the revisit of existing server consolidation solutions due to distin ...

Free cooling, i.e., directly using outside cold air and/or water to cool down datacenters, can provide significant power savings of datacenters. However, due to the limited cooling capability, which is tightly coupled with climate conditions, free cooling ...

Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, v ...

On-chip memory organization is one of the most important aspects that can influence the overall system behavior in multi-processor systems. Following the trend set by high-performance processors, high-end embedded cores are moving from single-level on chip ...

Modern system-on-chips are evolving towards complex and heterogeneous platforms with general-purpose processors coupled with massively parallel manycore accelerator fabrics (e.g. embedded GPUs). Platform developers are looking for efficient full-system sim ...

Personal health monitoring systems can offer a cost-effective solution for human healthcare. To extend the lifetime of health monitoring systems, we propose a near-threshold ultra-low- power multi-core architecture featuring low-power cores, yet capable of ...

Simulators are still the primary tools for development and performance evaluation of applications running on massively parallel architectures. However, current virtual platforms are not able to tackle the complexity issues introduced by 1000-core future sc ...

With the rising challenges in heat removal in integrated circuits (ICs), the development of thermal-aware computing architectures and run-time management systems have become indispensable to the continuation of IC design scaling. These thermal-aware design ...

In the last years the process of examining large amounts of different types of data, or Big-Data, in an effort to uncover hidden patterns or unknown correlations has become a major need in our society. In this context, stream mining applications are now wi ...

Emerging massively parallel architectures such as a general-purpose processor plus many-core programmable accelerators are creating an increasing demand for novel methods to perform their architectural simulation. Most state-of-the-art simulation technolog ...

Heat removal is one of the major challenges faced in developing the new generation of high density integrated circuits. Future design technologies strongly depend on the availability of efficient means for thermal modeling and analysis. These thermal model ...

This paper introduces SIMinG-1k-a manycore simulator infrastructure. SIMinG-1k is a graphics processing unit accelerated, parallel simulator for design-space exploration of large-scale manycore systems. It features an optimal trade-off between modeling acc ...

Energy consumption is a significant obstacle to integrate deep learning into edge devices. Two common techniques to curve it are quantization, which reduces the size of the memories (static energy) and the number of accesses (dynamic energy), and voltage s ...

Temperature-driven floorplaners have been recently proposed to alleviate the thermal problem in 3D multi-processor systems-on-chip (MPSoC). However, the proposed algorithms fail to provide fast placement of the modules when the complexity and the number of ...

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract ...

Martino Ruggiero

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GPGPU-Accelerated Parallel and Fast Simulation of Thousand-core Platforms

Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

Correlation-Aware Virtual Machine Allocation for Energy-Efficient Datacenters

Free Cooling-Aware Dynamic Power Management for Green Datacenters

3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling

Performance and Energy Trade-offs Analysis of L2 on-Chip Cache Architectures for Embedded MPSoCs

Full System Simulation of Many-Core Heterogeneous SoCs using GPU and QEMU Semihosting

Multi-Core Architecture Design for Ultra-Low-Power Wearable Health Monitoring Systems

Scalable instruction set simulator for thousand-core architectures running on GPGPUs

Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs

Low Power and Scalable Many-Core Architecture for Big-Data Stream Computing

GPU Acceleration for Simulating Massively Parallel Many-Core Platforms

Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

SIMinG-1k: A thousand-core simulator running on general-purpose graphical processing units

Impact of Memory Voltage Scaling on Accuracy and Resilience of Deep Learning Based Edge Devices

Fast and Scalable Temperature-driven Floorplan Design in 3D MPSoCs

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks

Scalable Instruction Set Simulator for Thousand-core Architectures Running on GPGPUs