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David Atienza Alonso

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Related publications (385)

Design Methods and Tools for 3D Integration

Yusuf Leblebici, Giovanni De Micheli, David Atienza Alonso, Vasileios Pavlidis

The design of 3-dimensional integrated circuits requires new specialized tools, methods and flows. Whereas some tools are on the market and some design flows for standard ICs are extended to handle die stacking and through-silicon vias, much R&D has still ...

2011

A High–Performance Parallel Implementation of the Chambolle Algorithm

David Atienza Alonso, Abdulkadir Akin, Ivan Beretta, Alessandro Antonio Nacci

The determination of the optical flow is a central problem in image processing, as it allows to describe how an image changes over time by means of a numerical vector field. The estimation of the optical flow is however a very complex problem, which has be ...

ACM and IEEE Press2011

A Real-Time Compressed Sensing-Based Personal Electrocardiogram Monitoring System

David Atienza Alonso, Nadia Khaled, Hossein Mamaghanian, Karim Kanoun

Wireless body sensor networks (WBSN) hold the promise to enable next-generation patient-centric tele-cardiology systems. A WBSN-enabled electrocardiogram (ECG) monitor consists of wearable, miniaturized and wireless sensors able to measure and wirelessly r ...

ACM and IEEE Press2011

3D Thermal-Aware Floorplanner for Many-Core Single-Chip Systems

David Atienza Alonso, José Luis Ayala Rodrigo

Heat removal and power density distribution delivery have become two major reliability concerns in 3D stacked technology. In this paper, we propose a thermal-driven 3D floorplanner. Our contributions include: (1) a novel multi-objective formulation to cons ...

IEEE Press2011

Development and Evaluation of Multi-Lead Wavelet-Based ECG Delineation Algorithms for Embedded Wireless Sensor Nodes

David Atienza Alonso, Francisco Javier Rincon Vallejos, Nadia Khaled

This work is devoted to the evaluation of multilead digital wavelet transform (DWT)-based electrocardiogram (ECG) wave delineation algorithms, which were optimized and ported to a commercial wearable sensor platform. More specifically, we investigate the u ...

Institute of Electrical and Electronics Engineers2011

GPGPU-Accelerated Parallel and Fast Simulation of Thousand-core Platforms

David Atienza Alonso, Luca Benini, Martino Ruggiero, Shivani Raghav

The multicore revolution and the ever-increasing complexity of computing systems is dramatically changing system design, analysis and programming of computing platforms. Future architectures will feature hundreds to thousands of simple processors and on-ch ...

IEEE/ACM Press2011

Energy-Efficient Multi-Objective Thermal Control for Liquid-Cooled 3D Stacked Architectures

David Atienza Alonso, Ayse Kivilcim Coskun, Mohamed Mostafa Sabry Aly

3D stacked systems reduce communication delay in multiprocessor system-on-chips (MPSoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates temperatureinduced problems such ...

Institute of Electrical and Electronics Engineers2011

Power/Performance Exploration of Single-core and Multi-core Processor Approaches for Biomedical Signal Processing

David Atienza Alonso, Luca Benini, Ahmed Yasir Dogan, Andreas Peter Burg

This study presents a single-core and a multi-core processor architecture for health monitoring systems where slow biosignal events and highly parallel computations exist. The single-core architecture is composed of a processing core (PC), an instruction m ...

Springer-Verlag Heidelberg2011

Hierarchical Thermal Management Policy for High-Performance 3D Systems with Liquid Cooling

Giovanni De Micheli, David Atienza Alonso, Francesco Zanini, Mohamed Mostafa Sabry Aly

3-Dimensional integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3-D multi-processor systems-onchip (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by mea ...

2011

Attaining Single-Chip, High-Performance Computing Through 3D Systems with Active Cooling

David Atienza Alonso, Ayse Kivilcim Coskun, Mohamed Mostafa Sabry Aly, Jie Meng

Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it provides high transistor integration densities, improves manufacturing yield due to smaller chip area, reduces wirelength and capacitance, and enables heteroge ...

Institute of Electrical and Electronics Engineers2011

Thermal-Aware System-Level Modeling and Management for Multi-Processor Systems-on-Chip

Giovanni De Micheli, David Atienza Alonso, Luca Benini, Francesco Zanini

Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet commercially viable, solution to answer the strong and steadily growing demand for scalable and high performance systems, at limited design complexity. Howev ...

IEEE Press2011

Run-Time Adaptable On-Chip Predictive Thermal Triggers

David Atienza Alonso, Pratyush Kumar

With ever-increasing power densities, Dynamic Thermal Management (DTM) techniques have become mainstream in today’s systems. An important component of such techniques is the thermal trigger. It has been shown that predictive thermal triggers can outperform ...

ACM and IEEE Press2011

Island-Based Adaptable Embedded System Design

David Atienza Alonso, Ivan Beretta

Nowadays, hardware devices are meant to host the execution of many complex, multi-core applications, whose functional and non-functional requirements vary according to the specific working domain. In this work, we propose a design methodology that combines ...

Institute of Electrical and Electronics Engineers2011

Real-Time Compressed Sensing-Based Electrocardiogram Compression on Energy Constrained Wireless Body Sensors

Pierre Vandergheynst, David Atienza Alonso, Nadia Khaled, Hossein Mamaghanian

Wireless body sensor networks (WBSN) hold the promise to enable next-generation patient-centric tele-cardiology systems. A WBSNenabled electrocardiogram (ECG) monitor consists of wearable, miniaturized and wireless sensors able to measure and wirelessly re ...

IEEE Press2011

Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Martino Ruggiero, Alessandro Vincenzi

Heat removal is one of the major challenges faced in developing the new generation of high density integrated circuits. Future design technologies strongly depend on the availability of efficient means for thermal modeling and analysis. These thermal model ...

ACM and IEEE Press2011

A Mapping Flow for Dynamically Reconfigurable Multi-Core System-on-Chip Design

David Atienza Alonso, Ivan Beretta

Nowadays, multi-core Systems-on-Chip (SoCs) are typically required to execute multiple complex applications, which demand a large set of heterogeneous hardware cores with different sizes. In this context, the popularity of dynamically reconfigurable platfo ...

Institute of Electrical and Electronics Engineers2011

Compressed Sensing for Real-Time Energy-Efficient ECG Compression on Wireless Body Sensor Nodes

Pierre Vandergheynst, David Atienza Alonso, Nadia Khaled, Hossein Mamaghanian

Wireless body sensor networks (WBSN) hold the promise to be a key enabling information and communications technology for next-generation patient-centric tele-cardiology or mobile cardiology solutions. Through enabling continuous remote cardiac monitoring, ...

Institute of Electrical and Electronics Engineers2011

Simulation of High-Performance Memory Allocators

David Atienza Alonso, José Luis Risco Martin

Elsevier2011

A Hybrid Mapping-Scheduling Technique for Dynamically Reconfigurable Hardware

David Atienza Alonso, Ivan Beretta

Reconfigurable computing is a promising technology that offers an interesting trade-off between flexibility and performance, which many recent multi-core embedded system applications demand. In order to achieve these objectives, it is necessary to optimize ...

ACM and IEEE Press2011

Thermal Analysis and Active Cooling Management for 3D MPSoCs

David Atienza Alonso, Ayse Kivilcim Coskun

3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and allowing more functionality per unit area. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling is a limitin ...

IEEE Press2011

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