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Yassir Madhour

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Related publications (5)

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STEAM: a fast compact thermal model for two-phase cooling of integrated circuits

John Richard Thome, David Atienza Alonso, Arvind Raj Mahankali Sridhar, Yassir Madhour

Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation ...

IEEE/ACM Press2013

Flow Boiling of R134a in a Multi-Microchannel Heat Sink with Hotspot Heaters for Energy-Efficient Microelectronic CPU Cooling Applications

John Richard Thome, Jonathan Olivier, Yassir Madhour, Etienne Costa-Patry

This paper focuses on two-phase flow boiling of refrigerant R134a inside a copper multi-microchannel heat sink for microelectronic central processing unit cooling applications. The heat sink is composed of 100 parallel microchannels, 100 mu m wide, 680 mu ...

2011

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Yusuf Leblebici, John Richard Thome, Michail Zervas, Yassir Madhour

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

John Richard Thome, Jackson Braz Marcinichen, Yassir Madhour, Brian Paul D'Entremont

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

3D Integrated Architectures for Microelectronic Two-Phase Flow Cooling Applications

Yassir Madhour

EPFL2014