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Lecture

Thermal Resistances & Bi Number

In course

ME-341: Heat and mass transfer

This course covers fundamentals of heat transfer and applications to practical problems. Emphasis will be on developing a physical and analytical understanding of conductive, convective, and radiative heat transfer. ...

Description

This lecture covers the concepts of thermal resistances, Bi number, and an introduction to thermal circuits. It explains conductive heat transfer, boundary conditions, heat diffusion equations, and assumptions for solving them. The lecture also delves into examples of heat diffusion, including planar walls and cylindrical pipes, and discusses thermal resistance in conduction, convection, and radiation. Furthermore, it explores the calculation of thermal resistances for different geometries and the concept of the overall heat transfer coefficient.

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Instructor

Giulia Tagliabue

Dr. Giulia Tagliabue is an Assistant Professor at the Institute of Mechanical Engineering (IGM). She obtained her B.S. and M.S degrees cum laude in Mechanical Engineering from the University of Udine in Italy. Concurrently she also obtained the diploma from the Scuola Normale Superiore of Udine. In 2015 she obtained her PhD in Mechanical Engineering from ETH Zurich with a thesis on nanophotonic design for light-to-heat and light-to-charge conversion devices. In 2015 Dr. Tagliabue was awarded the Early Mobility Fellowship from the Swiss National Science Foundation and moved to Caltech as a PostDoctoral fellow. In 2017, thanks to the award of an Advanced Mobility Fellowship, she prolonged her stay at Caltech. Here, in collaboration with the Joint Center for Artificial Photosynthesis (JCAP) she investigated coupled light, heat and charge transfer processes in nanophotonic structures and low-dimensional materials for photoelectrochemical and photovoltaic sustainable energy conversion.

Official source

Ontological neighbourhood

Mechanical engineering

Thermal engineering: Air conditioning

Related concepts (32)

Thermal conduction

Conduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.

Thermal resistance

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.

Heat transfer

Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.

Heat transfer coefficient

In thermodynamics, the heat transfer coefficient or film coefficient, or film effectiveness, is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference, ΔT ). It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid. The heat transfer coefficient has SI units in watts per square meter per kelvin (W/m2/K).

Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

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