Lecture

Thin Film Devices: BCI

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In course

NX-422: Neural interfaces

Neural interfaces (NI) are bioelectronic systems that interface the nervous system to digital technologies. This course presents their main building blocks (transducers, instrumentation & communication), reviews current and upcoming materials and technolog ...

Description

This lecture covers the fabrication process of thin film devices for Brain-Computer Interfaces (BCI). Topics include interconnect resistance, microfabrication techniques, process flow for thin metal tracks, encapsulation materials, vapor phase processed plastics like Parylenes, and the properties of Parylene coatings.

Instructors (2)

Mahsa Shoaran

Stéphanie Lacour

Stéphanie P. Lacour holds the Bertarelli Foundation Chair in Neuroprosthetic Technology in the School of Engineering at EPFL and leads the Laboratory for Soft Bioelectronic Interfaces. She received her PhD in Electrical Engineering from INSA de Lyon, France, and completed postdoctoral research at Princeton University and the University of Cambridge. She is the recipient of the 2006 MIT TR35, a University Research Fellowship of the Royal Society, European Research Council ERC Starting and POC Grants, and a SNSF-ERC Consolidator Grant. She was elected a 2015 Young Global Leader by the World Economic Forum.

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Related concepts (32)

Etching (microfabrication)

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.

Brain–computer interface

A brain–computer interface (BCI), sometimes called a brain–machine interface (BMI) or smartbrain, is a direct communication pathway between the brain's electrical activity and an external device, most commonly a computer or robotic limb. BCIs are often directed at researching, mapping, assisting, augmenting, or repairing human cognitive or sensory-motor functions. They are often conceptualized as a human–machine interface that skips the intermediary component of the physical movement of body parts, although they also raise the possibility of the erasure of the discreteness of brain and machine.

Photolithography

In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate.

Microfabrication

Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades microelectromechanical systems (MEMS), microsystems (European usage), micromachines (Japanese terminology) and their subfields, microfluidics/lab-on-a-chip, optical MEMS (also called MOEMS), RF MEMS, PowerMEMS, BioMEMS and their extension into nanoscale (for example NEMS, for nano electro mechanical systems) have re-used, adapted or extended microfabrication methods.

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.

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Brain-Computer Interfaces: Silicon Technologies

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Encapsulation: BCI

Covers the properties of Parylene, hermeticity, thin film encapsulation, conductive coatings, and electrode arrays.

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