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Lecture

CMOS Inverter Fabrication

In course

EE-330: Digital IC design

Digital IC Design presents the fundamentals of digital integrated circuit design. The methods and techniques aiming at the fabrication and development of digital integrated circuits are reviewed, the major design style pertaining to digital logic and memor ...

Description

This lecture covers the fabrication process of a CMOS inverter, starting with the creation of the n-well and the definition of the p-MOSFET and n-MOSFET. It then explains the steps for defining the polysilicon gate, pt diffusion, nt diffusion, contact holes, and metall connections. The lecture also delves into the thermal oxidation and doping processes involved in creating controlled conductivity zones. It further explores the techniques of diffusion and ion implantation, emphasizing their importance in modern CMOS fabrication processes. The lecture concludes with an overview of transferring patterns to the wafer surface, including the types of photoresists and printing methods used in the process.

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Instructor

Alexandre Schmid

Alexandre Schmid received the M.Sc. degree in microengineering and the Ph.D. degree in electrical engineering from the Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland, in 1994 and 2000, respectively. Since 1994, he has been with the EPFL, working with the Integrated Systems Laboratory as a Research and Teaching Assistant, and with the Electronics Laboratories as a Postdoctoral Fellow. In 2002, he was a Senior Research Associate with the Microelectronic Systems Laboratory, where he has been conducting research in the fields of bioelectronic interfaces and implantable biomedical electronics, nonconventional signal processing and neuromorphic hardware, and reliability of nanoelectronic devices, and also teaches with the Microengineering and Electrical Engineering Departments of EPFL. Since 2011, he is a Maître d'Enseignement et de Recherche (MER) Faculty Member with EPFL. He is a coauthor of two books, Reliability of Nanoscale Circuits and Systems, Methodologies and Circuit Architectures, Springer, 2011, and Wireless Cortical Implantable Systems, Springer, 2013, and a coeditor of one book, as well as over 100 articles published in journals and conferences. Dr. Schmid has served as the General Chair of the Fourth International Conference on Nano-Networks in 2009 and has been serving as an Associate Editor of the Institute of Electrical, Information, and Communication Engineers Electronics Express since 2009.

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Related concepts (32)

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.

Doping (semiconductor)

In semiconductor production, doping is the intentional introduction of impurities into an intrinsic semiconductor for the purpose of modulating its electrical, optical and structural properties. The doped material is referred to as an extrinsic semiconductor. Small numbers of dopant atoms can change the ability of a semiconductor to conduct electricity. When on the order of one dopant atom is added per 100 million atoms, the doping is said to be low or light.

Semiconductor fabrication plant

In the microelectronics industry, a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory for semiconductor device fabrication. Fabs require many expensive devices to function. Estimates put the cost of building a new fab over one billion U.S. dollars with values as high as

3–4 billion not being uncommon. TSMC invested

9.3 billion in its Fab15 300 mm wafer manufacturing facility in Taiwan. The same company estimations suggest that their future fab might cost $20 billion.

Semiconductor

A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities ("doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created.

Photolithography

In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate.

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