Lecture

Heterogeneous Integration: Smart Systems on Foil

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In course

MICRO-505: Organic and printed electronics

This course addresses the implementation of organic and printed electronics technologies using large area manufacturing techniques. It will provide knowledge on materials, printing techniques, devices, systems, and applications: state of the art and curren ...

Description

This lecture covers the integration of silicon components on polymeric foils, focusing on hybrid printed electronics. Topics include techniques for assembling components, examples of integrated devices, challenges in flexible system design, and methods for smart sensing systems. The lecture also discusses the process flow for hybrid systems, challenges in transferring silicon components, and the use of electrically conductive adhesives. Various interconnection techniques, such as through foil vias and anisotropic conductive adhesive, are explored for foil-to-foil integration. The lecture concludes with discussions on finishing techniques for mechanical stability and protection, as well as a case study on a hybrid smart sensing RFID label.

Instructors (2)

Danick Briand

Expertise MEMS and MicrosystemsFlexible and Printed ElectronicsEnergy Harvesting and PowerMEMSSmart Sensing SystemsAdvanced Gas Sensing TechnologiesMicrofabrication and Printing technologiesMicrosystems Integration and Packaging Expertise MEMS and MicrosystemsFlexible and Printed ElectronicsEnergy Harvesting and PowerMEMSSmart Sensing SystemsAdvanced Gas Sensing TechnologiesMicrofabrication and Printing technologiesMicrosystems Integration and Packaging Mission Environmentally-friendly technology is a rapid

Vivek Subramanian

Teaching & PhD PhD Students Giovanni Ruffolo, Giada Romano, Sanjay Manoharan, Kyle Haas, Claude Dahan, Biruktait Ayele Lemecho, Yagmur Ceren Alatas, Tugçe Delipinar Past EPFL PhD Students Amin Hodaei, Mustafa Mohieldin Fadlelmula Fadlelseed Past EPFL PhD Students as codirector Mohammad Jafarpour Courses Organic and printed electronics MICRO-505 This course addresses the implementation of organic and printed electronics technologies using large area manufacturing techniques. It will provide

Official source

Related concepts (32)

Flexible electronics

Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use.

Printed electronics

Printed electronics is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. By electronic-industry standards, these are low-cost processes. Electrically functional electronic or optical inks are deposited on the substrate, creating active or passive devices, such as thin film transistors; capacitors; coils; resistors.

Organic electronics

Organic electronics is a field of materials science concerning the design, synthesis, characterization, and application of organic molecules or polymers that show desirable electronic properties such as conductivity. Unlike conventional inorganic conductors and semiconductors, organic electronic materials are constructed from organic (carbon-based) molecules or polymers using synthetic strategies developed in the context of organic chemistry and polymer chemistry.

Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.

Monocrystalline silicon

Monocrystalline silicon, more often called single-crystal silicon, in short mono c-Si or mono-Si, is the base material for silicon-based discrete components and integrated circuits used in virtually all modern electronic equipment. Mono-Si also serves as a photovoltaic, light-absorbing material in the manufacture of solar cells. It consists of silicon in which the crystal lattice of the entire solid is continuous, unbroken to its edges, and free of any grain boundaries (i.e. a single crystal).

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Printed Electronics: Manufacturing and Applications

Covers the history, trends, challenges, and applications of printed electronics, emphasizing large area manufacturing processes and flexible substrates.

Organic and Printed Electronics: Applications, Markets, Roadmaps

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Organic and Printed Electronics