Lecture

Polymer Microfabrication: Techniques and Applications

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In course

MICRO-431: Materials and technology of microfabrication

The student will learn procedures and applications of modern microfabrication technologies, as practiced in a clean room environment, in particular modern techniques that go beyond the classical steps of deposition, lithography and etching, with a focus on ...

Description

This lecture covers various micromoulding technologies such as casting, injection molding, and hot embossing used in polymer microfabrication. It explains the process of replica molding or casting of PDMS, emphasizing the fabrication steps and applications. The instructor discusses the challenges and advantages of each technique, highlighting the importance of precise control over parameters like temperature and pressure. Additionally, the lecture delves into surface treatments for enhancing bonding between polymers, including plasma treatment and solvent softening. The presentation also explores advanced topics like chaotic mixing using source-sink microfluidic flows and localized bonding methods like microwave welding, ultrasonic welding, and laser welding.

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Instructors (2)

Thomas Lehnert

Martinus Adela Maria Gijs

Martin A.M. Gijs received his degree in physics in 1981 from the Katholieke Universiteit Leuven, Belgium and his Ph.D. degree in physics at the same university in 1986. He joined the Philips Research Laboratories in Eindhoven, The Netherlands, in 1987. Subsequently, he has worked there on micro-and nano-fabrication processes of high critical temperature superconducting Josephson and tunnel junctions, the microfabrication of microstructures in magnetic multilayers showing the giant magnetoresistance effect, the design and realisation of miniaturised motors for hard disk applications and the design and realisation of planar transformers for miniaturised power applications. He joined EPFL in 1997. His present interests are in developing technologies for novel magnetic devices, new microfabrication technologies for microsystems fabrication in general and the development and use of microsystems technologies for microfluidic and biomedical applications in particular.

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Related concepts (32)

Ionic bonding

Ionic bonding is a type of chemical bonding that involves the electrostatic attraction between oppositely charged ions, or between two atoms with sharply different electronegativities, and is the primary interaction occurring in ionic compounds. It is one of the main types of bonding, along with covalent bonding and metallic bonding. Ions are atoms (or groups of atoms) with an electrostatic charge. Atoms that gain electrons make negatively charged ions (called anions). Atoms that lose electrons make positively charged ions (called cations).

Chemical bond

A chemical bond is a lasting attraction between atoms or ions that enables the formation of molecules, crystals, and other structures. The bond may result from the electrostatic force between oppositely charged ions as in ionic bonds, or through the sharing of electrons as in covalent bonds. The strength of chemical bonds varies considerably; there are "strong bonds" or "primary bonds" such as covalent, ionic and metallic bonds, and "weak bonds" or "secondary bonds" such as dipole–dipole interactions, the London dispersion force, and hydrogen bonding.

Bonding molecular orbital

In theoretical chemistry, the bonding orbital is used in molecular orbital (MO) theory to describe the attractive interactions between the atomic orbitals of two or more atoms in a molecule. In MO theory, electrons are portrayed to move in waves. When more than one of these waves come close together, the in-phase combination of these waves produces an interaction that leads to a species that is greatly stabilized. The result of the waves’ constructive interference causes the density of the electrons to be found within the binding region, creating a stable bond between the two species.

Covalent bond

A covalent bond is a chemical bond that involves the sharing of electrons to form electron pairs between atoms. These electron pairs are known as shared pairs or bonding pairs. The stable balance of attractive and repulsive forces between atoms, when they share electrons, is known as covalent bonding. For many molecules, the sharing of electrons allows each atom to attain the equivalent of a full valence shell, corresponding to a stable electronic configuration. In organic chemistry, covalent bonding is much more common than ionic bonding.

Welding

Welding is a fabrication process that joins materials, usually metals or thermoplastics, by using high heat to melt the parts together and allowing them to cool, causing fusion. Welding is distinct from lower temperature techniques such as brazing and soldering, which do not melt the base metal (parent metal). In addition to melting the base metal, a filler material is typically added to the joint to form a pool of molten material (the weld pool) that cools to form a joint that, based on weld configuration (butt, full penetration, fillet, etc.

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