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Lecture

Thin-Film Processing: Removal and Deposition

In course

EE-330: Digital IC design

Digital IC Design presents the fundamentals of digital integrated circuit design. The methods and techniques aiming at the fabrication and development of digital integrated circuits are reviewed, the major design style pertaining to digital logic and memor ...

Description

This lecture covers the removal and deposition of thin-films in CMOS technology, including wet and dry etching techniques, chemical mechanical polishing, and thin-film deposition methods. It explains the parameters of thin-film removal, such as etch rate, selectivity, anisotropy, and uniformity. The process of chemical vapor deposition and physical vapor deposition is detailed, along with examples of PVD by evaporation and sputtering. It also discusses the formation of thin-films, step coverage, and aspect ratio. The lecture concludes with an overview of process integration in CMOS technology, focusing on the front-end-of-line and back-end-of-line processes.

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Instructor

Alexandre Schmid

Alexandre Schmid received the M.Sc. degree in microengineering and the Ph.D. degree in electrical engineering from the Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland, in 1994 and 2000, respectively. Since 1994, he has been with the EPFL, working with the Integrated Systems Laboratory as a Research and Teaching Assistant, and with the Electronics Laboratories as a Postdoctoral Fellow. In 2002, he was a Senior Research Associate with the Microelectronic Systems Laboratory, where he has been conducting research in the fields of bioelectronic interfaces and implantable biomedical electronics, nonconventional signal processing and neuromorphic hardware, and reliability of nanoelectronic devices, and also teaches with the Microengineering and Electrical Engineering Departments of EPFL. Since 2011, he is a Maître d'Enseignement et de Recherche (MER) Faculty Member with EPFL. He is a coauthor of two books, Reliability of Nanoscale Circuits and Systems, Methodologies and Circuit Architectures, Springer, 2011, and Wireless Cortical Implantable Systems, Springer, 2013, and a coeditor of one book, as well as over 100 articles published in journals and conferences. Dr. Schmid has served as the General Chair of the Fourth International Conference on Nano-Networks in 2009 and has been serving as an Associate Editor of the Institute of Electrical, Information, and Communication Engineers Electronics Express since 2009.

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Related concepts (32)

Chemical vapor deposition

Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Vacuum deposition

Vacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.

Physical vapor deposition

Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Electron-beam physical vapor deposition

Electron-beam physical vapor deposition, or EBPVD, is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.

Thin film

A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering.

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