Publications related to Semiconductor package

Related publications (26)

Controlling On-Surface Photoactivity: The Impact of π-Conjugation in Anhydride-Functionalized Molecules on a Semiconductor Surface

On-surface synthesis has become a prominent method for growing low-dimensional carbon-based nanomaterials on metal surfaces. However, the necessity of decoupling organic nanostructures from metal substrates to exploit their properties requires either trans ...

Wiley-VCH Verlag GmbH2024

An Ultralow-Power Triaxial MEMS Accelerometer With High-Voltage Biasing and Electrostatic Mismatch Compensation

Kyojin Choo

This article presents a triaxial micro electromechani-cal system (MEMS) capacitive accelerometer using a high-voltage biasing technique to achieve high resolution with ultralow power. The accelerometer system generates a differential pair of high voltages ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Joshua Alexander Harrison Klein, Rafael Medina Morillas

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Energy-Efficient Electronic Functions Based on the Co-integration of 2D and Ferroelectric Materials

Sadegh Kamaei Bahmaei

The digital revolution has significantly transformed our world over the past decades, driven by the scaling of transistor dimensions and the exponential increase in computation power. However, as the CMOS scaling era approaches its end, the semiconductor i ...

EPFL2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Chip-based soliton microcomb module using a hybrid semiconductor laser

Tobias Kippenberg, Junqiu Liu, Rui Ning Wang, Erwan Guillaume Albert Lucas, Jijun He, Arslan Sajid Raja, Nicolas Volet

Photonic chip-based soliton microcombs have shown rapid progress and have already been used in many system-level applications. There has been substantial progress in realizing soliton microcombs that rely on compact laser sources, culminating in devices th ...

2020

Integration of hybrid material systems in conformable neural interfaces

Florian Dylan Fallegger

Neural interfaces are devices that are implanted into the body and interface electrically with the central (CNS) or peripheral nervous system. They are inserted surgically for short periods of time or chronically to diagnose or treat several neural disease ...

EPFL2020

Multispectral image sensor and method for fabrication of an image sensor

Assim Boukhayma

The present invention relates to a multispectral image sensor having a pixel array for detecting images with light components in different wavelength ranges, comprising a plurality of imaging layers each embedded in a semiconductor substrate, wherein in ea ...

2020

Co-designing electronics with microfluidics for more sustainable cooling

Elison de Nazareth Matioli, Luca Nela, Remco Franciscus Peter van Erp, Reza Soleiman Zadeh Ardebili, Georgios Kampitsis

Thermal management is one of the main challenges for the future of electronics1,2,3,4,5. With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the powe ...

NATURE RESEARCH2020

Cuprous Oxide Photoelectrodes for Photoelectrochemical Water Splitting towards Unassisted Solar Hydrogen Production

Linfeng Pan

To handle global problems of energy and environmental pollution, efforts have been made to harvest energy from sunlight. Photoelectrochemcal water splitting is an efficient way to achieve sustainable solar-fuel production. However, to make this method comp ...

EPFL2019

Efficient Workload Colocation in Modern Data Centers

Calin Iorgulescu

Despite the high costs of acquisition and maintenance of modern data centers, machine resource utilization is often low. Servers running online interactive services are over-provisioned to support peak load (which only occurs for a fraction of the time), d ...

EPFL2019

Rapid identification and interpretation of gene‐environment associations using the new R.SamBada landscape genomics pipeline

Stéphane Joost, Kevin Leempoel, Sylvie Stucki, Estelle Rochat, Oliver Michele Selmoni, Elia Vajana, Solange Catherine Gaillard

Samβada is a genome‐environment association (GEA) software, designed to search for signatures of local adaptation. However, pre‐ and post‐processing of data can be labour‐intensive, preventing wider uptake of the method. We have now developed R.SamBada, an ...

2019

Modeling and Design Optimization of Medium Frequency Transformers for Medium-Voltage High-Power Converters

Marko Mogorovic

Novel high-power medium-voltage converter technologies offering galvanic insulation are needed to support the development of the emerging medium-voltage direct-current grids and further improve the performance of various other applications such as traction ...

EPFL2019

Computing with Ferroelectric FETs: Devices, Models, Systems, and Applications

Mihai Adrian Ionescu, Anisoara Ionescu, Virginie Anne Chenaux

In this paper, we consider devices, circuits, and systems comprised of transistors with integrated ferroelectrics. Said structures are actively being considered by various semiconductor manufacturers as they can address a large and unique design space. Tra ...

IEEE2018

Semiconductor device comprising a three-dimensional field plate

Elison de Nazareth Matioli, Jun Ma

The present invention relates to a Semiconductor device including a first electrode, a second electrode and at least one semiconductor material or layer between the first and second electrode. The semiconductor device further includes at least one field pl ...

2018

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Post-cmos processing and 3d integration based on dry-film lithography

Yusuf Leblebici, Carlotta Guiducci, Yüksel Temiz

A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the di ...

2015

Hybrid Optical Fibers – An Innovative Platform for In‐Fiber Photonic Devices

Fabien Sorin

The field of hybrid optical fibers is one of the most active research areas in current fiber optics and has the vision of integrating sophisticated materials inside fibers, which are not traditionally used in fiber optics. Novel in‐fiber devices with uniqu ...

2015

Snap-fit Joints - CNC fabricated, Integrated Mechanical Attachment for Structural Wood Panels

Yves Weinand, Christopher Werner Matthias Robeller, Paul Mayencourt

This presentation presents our reserach into the design and potential applications of CNC fabricated snap-fit joints for cross-laminated veneer lumber panels (LVL). These joints are new to the building construction sector, but commonly used in other domain ...

Riverside Architectural Press2014