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Related publications (24)

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Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Giovanni De Micheli, Luca Benini

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015

Large Arrays Of Inkjet-Printed Mems Microbridges On Foil

Nico de Rooij, Danick Briand, Francisco Molina Lopez

This works describes the fabrication process of an array of printed MEMS microbridges on polymeric foil, performed in only four easy steps. Each functional material was deposited exclusively by inkjet-printing technique, compatible with large-area fabricat ...

IEEE2014

Inkjet-printed SU-8 Hemispherical Microcapsules and Silicon chip Embedding

Jürgen Brugger, Victor Javier Cadarso Busto, Massimo Mastrangeli, Loïc Jacot-Descombes, Rosario Maurizio Gullo

Planar lithography techniques are not effective for precise fabrication of microdevices with hemispherical shapes. Drop-on-demand (DOD) inkjet printing (IJP) of photo-curable ink is a more appropriate fabrication approach as it takes advantage of the surfa ...

2013

Fabrication of Free-Standing Plasmonic Nanoantennas with Application for Optical Break Junctions

Olivier Martin, Christian Santschi, Banafsheh Abasahl

We report the fabrication of plasmonic nanoantennas with dimensions in the 200 - 300 nm range, suspended across a nano-undercut, which will be used for the investigation of the optical properties of break junctions. Nanochannels, fabricated using e-beam li ...

Ieee2012