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Emulation-Based Transient Thermal Modeling of 2D/3D Systems-on-Chip with Active Cooling

Publications associées (29)

Interlocking modular microfluidic cooling substrates for future high energy physics experiments

In high energy physics, semiconductor-based sensors are widely used in particle tracking applications. These sensors are typically glued on low-mass cooling substrates, which guarantee the correct thermal management and, at the same time, minimise their in ...

EPFL2023

Computational Imaging SPAD Cameras

Andrei Ardelean

Vision systems built around conventional image sensors have to read, encode and transmit large quantities of pixel information, a majority of which is redundant. As a result, new computational imaging sensor architectures were developed to preprocess the r ...

EPFL2023

Adaptive isogeometric methods with C-1 (truncated) hierarchical splines on planar multi-patch domains

Rafael Vazquez Hernandez

Isogeometric analysis is a powerful paradigm which exploits the high smoothness of splines for the numerical solution of high order partial differential equations. However, the tensor-product structure of standard multivariate B-spline models is not well s ...

WORLD SCIENTIFIC PUBL CO PTE LTD2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Broadband spectroscopy and inelastic light scattering on the canted antiferromagnet hematite for antiferromagnetic magnonics

Mohammad Hamdi

Collective spin excitations propagating in magnetically ordered materials are called spin waves (SWs) or magnons. They are promising for low-power and beyond-CMOS information processing, which do not suffer from the ohmic losses. SWs in ferromagnets (antif ...

EPFL2023

Acceleration of Control Intensive Applications on Coarse-Grained Reconfigurable Arrays for Embedded Systems

David Atienza Alonso, Benoît Walter Denkinger, Miguel Peon Quiros

Embedded systems confront two opposite goals: low-power operation and high performance. The current trend to reach these goals is toward heterogeneous platforms, including multi-core architectures with heterogeneous cores and hardware accelerators. The lat ...

2023

Compilation and Design Space Exploration of Dataflow Programs for Heterogeneous CPU-GPU Platforms

Aurélien François Gilbert Bloch

Today's continued increase in demand for processing power, despite the slowdown of Moore's law, has led to an increase in processor count, which has resulted in energy consumption and distribution problems. To address this, there is a growing trend toward ...

EPFL2023

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Joshua Alexander Harrison Klein, Rafael Medina Morillas

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

Automating the Design of Programmable Interconnect for Reconfigurable Architectures

Stefan Nikolic

With Moore's law coming to an end, increasingly more hope is being put in specialized hardware implemented on reconfigurable architectures such as Field-Programmable Gate Arrays (FPGAs). Yet, it is often neglected that these architectures themselves experi ...

EPFL2023