Publication

A Case for Heterogeneous Technology-Mapping: Soft versus Hard Multiplexers

Publications associées (31)

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Recently, we published an article [1] presenting how the Power Electronics course at the bachelor level is organized by the Power Electronics Laboratory and taught at Ecole Polytechnique Fédérale de Lausanne, EPFL, Switzerland. For those avid readers who m ...

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Instruction-Level Power Side-Channel Leakage Evaluation of Soft-Core CPUs on Shared FPGAs

Mirjana Stojilovic, Ognjen Glamocanin, Mathias Josef Payer, Shashwat Shrivastava, Jinwei Yao, Nour Ardo

Side-channel disassembly attacks recover CPU instructions from power or electromagnetic side-channel traces measured during code execution. These attacks typically rely on physical access, proximity to the victim device, and high sampling rate measuring in ...

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Integrated Electronics for Deep Implants to Remotely Monitor Hemodynamics

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The integration of technology in the medical field has greatly improved accuracy in diagnoses, thus leading to more effective treatments. Wearable and implantable medical devices offer great potential for remote patient monitoring, particularly for heart f ...

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REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

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Acceleration of Control Intensive Applications on Coarse-Grained Reconfigurable Arrays for Embedded Systems

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Embedded systems confront two opposite goals: low-power operation and high performance. The current trend to reach these goals is toward heterogeneous platforms, including multi-core architectures with heterogeneous cores and hardware accelerators. The lat ...

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An All-Digital 1 Mbps, 57 pJ/bit Bluetooth Low Energy (BLE) Backscatter ASIC in 65 nm CMOS

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We present an all-digital application specific integrated circuit (ASIC) that implements Bluetooth Low Energy (BLE)-compatible backscatter communication. The ASIC was fabricated in a 65 nm CMOS process and occupies an active area of 0.12 mm(2) while consum ...

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Field-programmable gate arrays (FPGAs) combine hardware reconfigurability with a high degree of parallelism. Consequently, FPGAs offer performance gains and power savings for many applications. A recent trend has been to leverage the hardware versatility o ...

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Thermal and Power-Aware Run-Time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Halima Najibi, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse

Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor Syste ...

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Assessment of the Bundle SNSPD Plus FPGA-Based TDC for High-Performance Time Measurements

Christophe Marcel Georges Galland, Andrea Costa, Santiago Tarrago Velez

Counting single photons and measuring their arrival time is of crucial importance for imaging and quantum applications that use single photons to outperform classical techniques. The investigation of the coincidence, i.e. correlation, between photons can b ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

Source Reconstruction Method Using Phase-Less Magnetic Near-Field Measurements: Application of the Method of Moment with Roof-Top Basis Functions

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Source reconstruction methods have many applications such as antenna diagnosis, calculating far-field radiated emissions, and identifying incompatible sources on integrated circuits or printed circuit boards. In this paper, the Gerchberg-Saxton algorithm i ...

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Design and management of three-dimensional multi-processor systems-on-chip with integrated flow cell arrays

Halima Najibi

Three-Dimensional Multi-Processor Systems-on-Chip (3D MPSoCs) are promising solutions for highly intensive Artificial Intelligence (AI) and Big Data applications. They combine remarkably dense computation capabilities and massive communication bandwidths. ...

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