Publications associées à Decoding Nanowire Arrays Fabricated with the Multi-Spacer Patterning Technique

Publications associées (33)

Advanced Silicon and SWIR Single-Photon Avalanche Diodes: Design, Simulation, and Characterization

Low-level light detection with high spatial and timing accuracy is a growing area of interest by virtue of applications such as light detection and ranging (LiDAR), biomedical imaging, time-resolved Raman spectroscopy, and quantum applications. Single-phot ...

EPFL2024

Additively manufactured stretchable zipping electrostatic actuators

Giulio Grasso

The use of soft and stretchable materials allows the development of adaptive robotic systems and human-machine interfaces that are more natural and comfortable to interact with. One of the application fields that benefits the most from these compliant mate ...

EPFL2024

Optimizing Atomic Layer Deposition Processes with Nanowire-Assisted TEM Analysis

Ivo Utke, Johann Michler, Xavier Maeder

Atomic layer deposition (ALD) is one of the premier methods to synthesize ultra-thin materials on complex surfaces. The technique allows for precise control of the thickness down to single atomic layers, while at the same time providing uniform coverage ev ...

Wiley2024

Silicon microresonator arrays: A comprehensive study on fabrication techniques and pH-controlled stress-induced variations in cantilever stiffness

Luis Guillermo Villanueva Torrijo, Annalisa De Pastina

We introduce a detailed design and fabrication process of Silicon microcantilever arrays for biomolecular detection in liquid environment, utilized with laser readout. We present typical fabrication problems and provide related solutions to obtain high qua ...

Elsevier2024

Lithium tantalate photonic integrated circuits for volume manufacturing

Tobias Kippenberg, Johann Emmeram Riemensberger, Mikhail Churaev, Xinru Ji, Zihan Li, Terence Albert Emile Blésin, Chengli Wang, Junyin Zhang, Xi Wang, Chen Yang, Wil Kao, Alisa Davydova

Electro-optical photonic integrated circuits (PICs) based on lithium niobate (LiNbO3) have demonstrated the vast capabilities of materials with a high Pockels coefficient1,2. They enable linear and high-speed modulators operating at complementary metal–oxi ...

2024

3D Printing of Customizable Transient Bioelectronics and Sensors

Danick Briand, Nicolas Francis Fumeaux

Transient electronics have emerged as a new category of devices that can degrade after their functional lifetime, offering tremendous potential as disposable sensors, actuators, wearables, and implants. Additive manufacturing methods represent a promising ...

2024

Zinc hybrid sintering for printed transient sensors and wireless electronics

Danick Briand, Nicolas Francis Fumeaux

Transient electronics offer a promising solution for reducing electronic waste and for use in implantable bioelectronics, yet their fabrication remains challenging. We report on a scalable method that synergistically combines chemical and photonic mechanis ...

2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

A multi-material robotic finger with integrated proprioceptive and tactile capabilities produced with a circular process

Josephine Anna Eleanor Hughes, Kai Christian Junge, Antonia Georgopoulou Papadonikolaki

When developing or designing biomimetic robotic fingers with rigid and soft components and integrated sensors, fabrication is often a bottle-neck when assembling and casting processing techniques are used. This study introduces a thermoplastic multi-materi ...

IEEE2023

Energy-Efficient Electronic Functions Based on the Co-integration of 2D and Ferroelectric Materials

Sadegh Kamaei Bahmaei

The digital revolution has significantly transformed our world over the past decades, driven by the scaling of transistor dimensions and the exponential increase in computation power. However, as the CMOS scaling era approaches its end, the semiconductor i ...

EPFL2023

Additive and digital manufacturing of transient sensors and bioelectronics

Nicolas Francis Fumeaux

Transient electronics have emerged as a promising class of devices, capable of breaking down without harmful side effects to their environment. They have tremendous potential as bioresorbable electronics for temporary applications in the human body, and as ...

EPFL2023

Volumetric additive manufacturing in a scattering resin

Jorge Andres Madrid Wolff

Volumetric 3D printing is a novel technique that offers promising new perspectives in tissue engineering. In volumetric 3D printing, photosensitive gels or liquids are solidified by projecting light patterns via reverse tomography. Recent results show that ...

EPFL2023

Semiconductor-based device architectures in multimaterial fibers

William Nicolas Duncan Esposito

Semiconductor materials have given rise to today's digital technology and consumer electronics. Widespread adoption is closely linked to the ability to process and integrate them in devices at scale. Where flexibility and large surfaces are required, such ...

EPFL2023

Printed degradable piezoelectric microsystems: From ink formulation to device fabrication and characterization

Morgan Mc Kay Monroe

As the world moves further and further into the semiconductor era, the amount of waste generated from electronics ("e-waste") is increasing rapidly and unsustainably. Of particular note, alternatives to lead-based piezoelectric materials must be establishe ...

EPFL2023

Fab-to-fab and run-to-run variability in 130 nm and 65 nm CMOS technologies exposed to ultra-high TID

Gennaro Termo, Jean-Michel Sallese, Adil Koukab

The discovery of a large fab-to-fab variability in the TID response of the CMOS technologies used in the design of ASICs for the particle detectors of the HL-LHC triggered a monitoring effort to verify the consistency of the CMOS production process over ti ...

IOP Publishing Ltd2023

Selective Growth of van der Waals Heterostructures Enabled by Electron-Beam Irradiation

Aleksandra Radenovic, Michal Daniel Macha

Van der Waals heterostructures (vdWHSs) enable the fabricationof complex electronic devices based on two-dimensional (2D) materials.Ideally, these vdWHSs should be fabricated in a scalable and repeatableway and only in the specific areas of the substrate t ...

AMER CHEMICAL SOC2023

2D Nanosystems: Applications of 2D Semiconductors for In-Memory Computing

Guilherme Migliato Marega

Machine learning and data processing algorithms have been thriving in finding ways of processing and classifying information by exploiting the hidden trends of large datasets. Although these emerging computational methods have become successful in today's ...

EPFL2023

Computational Imaging SPAD Cameras

Andrei Ardelean

Vision systems built around conventional image sensors have to read, encode and transmit large quantities of pixel information, a majority of which is redundant. As a result, new computational imaging sensor architectures were developed to preprocess the r ...

EPFL2023

New ultrahigh-speed device concepts: from THz nanoplasma devices to glass-like electronics for neuromorphic computation

Mohammad Samizadeh Nikooytabalvandani

There is a never-ending push for electronic systems to provide faster operation speeds, higher energy efficiencies, and higher power capabilities at smaller scales. These requirements are apparent in different areas of electronics, from radiofrequency (RF) ...

EPFL2023

Silicon spin qubits from laboratory to industry

Edoardo Charbon

Quantum computation (QC) is one of the most challenging quantum technologies that promise to revolutionize data computation in the long-term by outperforming the classical supercomputers in specific applications. Errors will hamper this quantum revolution ...

IOP Publishing Ltd2023