Publications associées à Large Arrays Of Inkjet-Printed Mems Microbridges On Foil

3D Printing of Customizable Transient Bioelectronics and Sensors

Transient electronics have emerged as a new category of devices that can degrade after their functional lifetime, offering tremendous potential as disposable sensors, actuators, wearables, and implants. Additive manufacturing methods represent a promising ...

2024

Additively manufactured stretchable zipping electrostatic actuators

Giulio Grasso

The use of soft and stretchable materials allows the development of adaptive robotic systems and human-machine interfaces that are more natural and comfortable to interact with. One of the application fields that benefits the most from these compliant mate ...

EPFL2024

Advanced Silicon and SWIR Single-Photon Avalanche Diodes: Design, Simulation, and Characterization

Ekin Kizilkan

Low-level light detection with high spatial and timing accuracy is a growing area of interest by virtue of applications such as light detection and ranging (LiDAR), biomedical imaging, time-resolved Raman spectroscopy, and quantum applications. Single-phot ...

EPFL2024

Silicon microresonator arrays: A comprehensive study on fabrication techniques and pH-controlled stress-induced variations in cantilever stiffness

Luis Guillermo Villanueva Torrijo, Annalisa De Pastina

We introduce a detailed design and fabrication process of Silicon microcantilever arrays for biomolecular detection in liquid environment, utilized with laser readout. We present typical fabrication problems and provide related solutions to obtain high qua ...

Elsevier2024

An Ultralow-Power Triaxial MEMS Accelerometer With High-Voltage Biasing and Electrostatic Mismatch Compensation

Yimai Peng, Li Xu, Kyojin Choo

This article presents a triaxial micro electromechani-cal system (MEMS) capacitive accelerometer using a high-voltage biasing technique to achieve high resolution with ultralow power. The accelerometer system generates a differential pair of high voltages ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Evaluation of Interface and Residual Strain of NiTi Layer Deposited on NiTiX Substrate by Laser Powder Bed Fusion

Elyas Ghafoori, Christian Leinenbach, Irene Ferretto, Mahbod Golrang, Mahshid Memarian

This study investigates the microstructure and properties of functionally graded NiTi alloy bilayers. The NiTi layer is printed by laser powder bed fusion on a NiTiX (where X is Hf or Cu) substrate prepared by vacuum arc remelting. Specimens produced with ...

Wiley-V C H Verlag Gmbh2024

Succinct ordering and aggregation constraints in algebraic array theories

Viktor Kuncak, Rodrigo Raya

We discuss two extensions to a recently introduced theory of arrays, which are based on considerations coming from the model theory of power structures. First, we discuss how the ordering relation on the index set can be expressed succinctly by referring t ...

Elsevier Science Inc2024

Additive and digital manufacturing of transient sensors and bioelectronics

Nicolas Francis Fumeaux

Transient electronics have emerged as a promising class of devices, capable of breaking down without harmful side effects to their environment. They have tremendous potential as bioresorbable electronics for temporary applications in the human body, and as ...

EPFL2023

Light-Driven Thermo-Optical Effects in Nanoresonator Arrays

Giulia Tagliabue, Alfredo Angelo Luigi Naef, Ershad Mohammadi, Theodoros Tsoulos

Thermonanophotonics, that is the study of photothermal effects in optical nanoantennas, has recently attracted growing interest. In particular, going beyond thermoplasmonic designs, thermo-optical modulation of dielectric nanoantennas opens new opportuniti ...

WILEY-V C H VERLAG GMBH2023

Digital manufacturing of personalised footwear with embedded sensors

Danick Briand, Rubaiyet Iftekharul Haque, Ryan Mitchell van Dommelen, Jaemin Kim

The strong clinical demand for more accurate and personalized health monitoring technologies has called for the development of additively manufactured wearable devices. While the materials palette for additive manufacturing continues to expand, the integra ...

Nature Research2023

Printed degradable piezoelectric microsystems: From ink formulation to device fabrication and characterization

Morgan Mc Kay Monroe

As the world moves further and further into the semiconductor era, the amount of waste generated from electronics ("e-waste") is increasing rapidly and unsustainably. Of particular note, alternatives to lead-based piezoelectric materials must be establishe ...

EPFL2023

Energy-Efficient Electronic Functions Based on the Co-integration of 2D and Ferroelectric Materials

Sadegh Kamaei Bahmaei

The digital revolution has significantly transformed our world over the past decades, driven by the scaling of transistor dimensions and the exponential increase in computation power. However, as the CMOS scaling era approaches its end, the semiconductor i ...

EPFL2023

Print-Light-Synthesis of Gold Thin Film Electrodes for Electrochemical Sensing

Horst Pick, Andreas Stephan Lesch, Emanuela Maiorano

The one-step fabrication of gold films by inkjet printing of a gold precursor ink and its photochemical reduction by exposure to UV light is presented. Inkjet printing creates on a substrate with high control micrometer-thin reaction volumes in which upon ...

Wiley2023

Zinc hybrid sintering for printed transient sensors and wireless electronics

Danick Briand, Nicolas Francis Fumeaux

Transient electronics offer a promising solution for reducing electronic waste and for use in implantable bioelectronics, yet their fabrication remains challenging. We report on a scalable method that synergistically combines chemical and photonic mechanis ...

2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

2D Nanosystems: Applications of 2D Semiconductors for In-Memory Computing

Guilherme Migliato Marega

Machine learning and data processing algorithms have been thriving in finding ways of processing and classifying information by exploiting the hidden trends of large datasets. Although these emerging computational methods have become successful in today's ...

EPFL2023

Electronic metadevices for terahertz applications

Elison de Nazareth Matioli, Mohammad Samizadeh Nikooytabalvandani

The evolution of electronics has largely relied on downscaling to meet the continuous needs for faster and highly integrated devices(1). As the channel length is reduced, however, classic electronic devices face fundamental issues that hinder exploiting ma ...

NATURE PORTFOLIO2023

Overflow-free compute memories for edge AI acceleration

David Atienza Alonso, Giovanni Ansaloni, Alexandre Sébastien Julien Levisse, Flavio Ponzina, Marco Antonio Rios

Compute memories are memory arrays augmented with dedicated logic to support arithmetic. They support the efficient execution of data-centric computing patterns, such as those characterizing Artificial Intelligence (AI) algorithms. These architectures can ...

2023

Semiconductor-based device architectures in multimaterial fibers

William Nicolas Duncan Esposito

Semiconductor materials have given rise to today's digital technology and consumer electronics. Widespread adoption is closely linked to the ability to process and integrate them in devices at scale. Where flexibility and large surfaces are required, such ...

EPFL2023

A multi-material robotic finger with integrated proprioceptive and tactile capabilities produced with a circular process

Antonia Georgopoulou Papadonikolaki, Josephine Anna Eleanor Hughes, Kai Christian Junge

When developing or designing biomimetic robotic fingers with rigid and soft components and integrated sensors, fabrication is often a bottle-neck when assembling and casting processing techniques are used. This study introduces a thermoplastic multi-materi ...

IEEE2023