Publication

A glass-based, high density microelectrode array (MEA) with integrated CMOS amplification

Publications associées (32)

2D Nanosystems: Applications of 2D Semiconductors for In-Memory Computing

Machine learning and data processing algorithms have been thriving in finding ways of processing and classifying information by exploiting the hidden trends of large datasets. Although these emerging computational methods have become successful in today's ...

EPFL2023

Cascaded all-optical quantization employing step-size MMI and shape-optimized power splitter

Xiaowei Zhang, Ye Tian, Jian Wu, Jijun He

As a key unit of future high-throughput communications, optical analog to digital converter (OADC) with all-optical quantizer element that simultaneously possesses high resolution, large bandwidth and compact size is highly promising. A pending issue of co ...

ELSEVIER SCI LTD2023

MALTA-Cz: a radiation hard full-size monolithic CMOS sensor with small electrodes on high-resistivity Czochralski substrate

Edoardo Charbon, Ashish Sharma, Francesco Piro

Depleted Monolithic Active Pixel Sensor (DMAPS) sensors developed in the Tower Semiconductor 180 nm CMOS imaging process have been designed in the context of the ATLAS ITk upgrade Phase-II at the HL-LHC and for future collider experiments. The "MALTA-Czoch ...

Iop Publishing Ltd2023

Computational Imaging SPAD Cameras

Andrei Ardelean

Vision systems built around conventional image sensors have to read, encode and transmit large quantities of pixel information, a majority of which is redundant. As a result, new computational imaging sensor architectures were developed to preprocess the r ...

EPFL2023

Intelligent RF System for Ultra Low Power Spectrum Sensing with Machine Learning

Naci Pekçokgüler

The crowdedness of the RF spectrum constitutes problems in communication, however it also accommodates large amount of useful information. This information can be used to determine existing signals and operating contexts. However, spectrum condition varies ...

EPFL2024

High-speed turbocompressors for natural fluid heat-pumps: from integrated design to digital-twin

Luis Eric Olmedo Ocampo

Compressors for commercial and industrial heat-pumps in the 100kW-load range are currently dominated by positive displacementmachines. In the context of refrigerant phaseouts and changing regulations, natural refrigerants are seen as a compelling alternati ...

EPFL2023

A Delay and Power Efficient Voltage Level Shifter with Low Leakage Power

Alexandre Schmid, Mehdi Saberi

This paper presents a new power-efficient and high-speed voltage level shifter. In the proposed structure, the existing contentions at the internal nodes are reduced using auxiliary transistors and feedback networks, leading to a significant reduction in t ...

IEEE2023

Source Reconstruction Method Using Phase-Less Magnetic Near-Field Measurements: Application of the Method of Moment with Roof-Top Basis Functions

Marcos Rubinstein, Hamidreza Karami

Source reconstruction methods have many applications such as antenna diagnosis, calculating far-field radiated emissions, and identifying incompatible sources on integrated circuits or printed circuit boards. In this paper, the Gerchberg-Saxton algorithm i ...

IEEE2022

A Deep-Learning Approach to Side-Channel Based CPU Disassembly at Design Time

Mirjana Stojilovic

Side-channel CPU disassembly is a side-channel attack that allows an adversary to recover instructions executed by a processor. Not only does such an attack compromise code confidentiality, it can also reveal critical information on the system’s internals. ...

IEEE2022

Thermal and Power-Aware Run-Time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Halima Najibi, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse

Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor Syste ...

2022

Influence of Fin and Finger Number on TID Degradation of 16-nm Bulk FinFETs Irradiated to Ultrahigh Doses

Christian Enz

This article investigates the fin- and finger-number dependence of the total ionizing dose (TID) degradation in 16-nm bulk Si FinFETs at ultrahigh doses. n- and p-FinFETs designed with different numbers of fins and fingers are irradiated up to 500 Mrad(SiO ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

New Insights for Parasitic Effects of Label-Free Biosensors Based on Capacitive Micromachined Ultrasonic Transducers

Sandro Carrara, Zhengwen Jiang, Jie Li, Yihe Zhao

Capacitive micromachined ultrasonic transducers (CMUTs) are regarded as an attractive candidate in bio-applications such as imaging and molecule monitoring. However, the previous researches on biochemical sensing are mostly air-coupled application based on ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022