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Active Guard Ring Characterization for Smart Power ICs

Publications associées (31)

A Deep-Learning Approach to Side-Channel Based CPU Disassembly at Design Time

Side-channel CPU disassembly is a side-channel attack that allows an adversary to recover instructions executed by a processor. Not only does such an attack compromise code confidentiality, it can also reveal critical information on the system’s internals. ...

IEEE2022

Adaptive analysis-aware defeaturing

Ondine Gabrielle Chanon

Removing geometrical details from a complex domain is a classical operation in computer aided design for simulation and manufacturing. This procedure simplifies the meshing process, and it enables faster simulations with less memory requirements. However, ...

EPFL2022

Source Reconstruction Method Using Phase-Less Magnetic Near-Field Measurements: Application of the Method of Moment with Roof-Top Basis Functions

Marcos Rubinstein, Hamidreza Karami

Source reconstruction methods have many applications such as antenna diagnosis, calculating far-field radiated emissions, and identifying incompatible sources on integrated circuits or printed circuit boards. In this paper, the Gerchberg-Saxton algorithm i ...

IEEE2022

Stabilized isogeometric discretizations on trimmed and union geometries, and weak imposition of the boundary conditions for the Darcy flow

Riccardo Puppi

Modern manufacturing engineering is based on a ``design-through-analysis'' workflow. According to this paradigm, a prototype is first designed with Computer-aided-design (CAD) software and then finalized by simulating its physical behavior, which usually i ...

EPFL2022

Synthesis and Analysis of 3D shapes with Geometric Deep Learning in Computer-Aided Engineering

Edoardo Remelli

In this thesis, we advocate that Computer-Aided Engineering could benefit from a Geometric Deep Learning revolution, similarly to the way that Deep Learning revolutionized Computer Vision. To do so, we consider a variety of Computer-Aided Engineering pr ...

EPFL2022

Electrical Spectroscopy of Defect States in Synthetic 2D Materials

Yanfei Zhao

Two-dimensional (2D) materials such as graphene and transition metal dichalcogenide (TMDC) are considered as one of the most promising material platforms for future electronic devices, due to their ultra-thin thickness and fascinating electrical and optica ...

EPFL2022

Electrical control of glass-like dynamics in vanadium dioxide for data storage and processing

Andras Kis, Andreas Schueler, Anna Krammer, Elison de Nazareth Matioli, Reza Soleiman Zadeh Ardebili, Mohammad Samizadeh Nikooytabalvandani, Philip Johannes Walter Moll, Guilherme Migliato Marega

Metal–oxide–semiconductor junctions are the building blocks of modern electronics and can provide a variety of functionalities, from memory to computing. The technology, however, faces constraints in terms of further miniaturization and compatibility with ...

2022

Ontology-based system to support industrial system design for aircraft assembly

Dimitrios Kyritsis, Jinzhi Lu, Xiaochen Zheng

The development of an aircraft industrial system is a complex process which faces the challenge of digital discontinuity in multidisciplinary engineering due to various interfaces between different digital tools, leading to extra development time and costs ...

ELSEVIER2022

An a posteriori error estimator for isogeometric analysis on trimmed geometries

Ondine Gabrielle Chanon, Annalisa Buffa, Rafael Vazquez Hernandez

Trimming consists of cutting away parts of a geometric domain, without reconstructing a global parametrization (meshing). It is a widely used operation in computer-aided design, which generates meshes that are unfitted with the described physical object. T ...

2022

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Cockroach: an open-source tool for point cloud processing in cad

Yves Weinand, Julien Gamerro, Andrea Settimi, Petras Vestartas

In the architecture, engineering and construction (AEC) sector, the use of point cloud data is not a novelty. Usually employed to retrieve data for inspecting construction sites or retrofitting pre-existing buildings, sensors like LiDAR cameras have been k ...

Association for Computer-Aided Architectural Design Research in Asia (CAADRIA)2022