The strength of the interface between iron (Fe) and individual spherical silica (SiO2) inclusions of 5 +/- 1 mu m diameter is measured by means of in-situ micro-cantilever bending tests conducted under displacement control within a scanning electron micros ...
This work extends the range of pathways for the production of metallic microcomponents by downscaling metal casting. This is accomplished by using either of two different molding techniques, namely femtosecond laser micromachining or lithographic silicon m ...
Three-dimensional topological semimetals have emerged as strong candidates to probe new fundamental physical phenomena that could be exploited to develop next generation electronics. However, many aspects of their electronic properties remain unclear. Thi ...
Owing to their high specific stiffness and strength, Carbon Fiber Reinforced Composites (CFRP) are ideal candidates for the development of lightweight high-performance structures. Within this family, thin-ply composites allow for wider design freedom and p ...
Semiconductor materials have given rise to today's digital technology and consumer electronics. Widespread adoption is closely linked to the ability to process and integrate them in devices at scale. Where flexibility and large surfaces are required, such ...
Two-dimensional dopant layers (δ-layers) in semiconductors provide the high-mobility electron liquids (2DELs) needed for nanoscale quantum-electronic devices. Key parameters such as carrier densities, effective masses, and confinement thicknesses for 2DELs ...
Fatigue damage in materials results in localized strain at the microstructural level. In many engineering components of the cooling circuits of nuclear power plants, where austenitic steels are used, the material experiences multiaxial cyclic loading, eith ...
Recent advancements in miniature devices with higher computational capabilities and ultralow power consumption have accelerated the development of wearable sensors, actuators, and energy harvesters everywhere. The ultimate aim of such a technological revol ...
The plastic deformation of small-scale face-centered cubic metals exhibits intermittent slip burst events that appear on stress-strain curves as sudden strain jumps and/or load drops. These events are generally attributed to the avalanche-like cooperative ...
