Adaptive Task Migration Policies for Thermal control in MPSoCs

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Verification and testing of hardware heavily relies on cycle-accurate simulation of RTL. As single-processor performance is growing only slowly, conventional, single-threaded RTL simulation is becoming impractical for increasingly complex chip designs and ...

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The vast amount of computational studies on electrical conduction in solid-state electrolytes is not mirrored by comparable efforts addressing thermal conduction, which has been scarcely investigated despite its relevance to thermal management and (over)he ...

The time-honored Allen -Feldman theory of heat transport in glasses is generally assumed to predict a finite value for the thermal conductivity, even if it neglects the anharmonic broadening of vibrational normal modes. We demonstrate that the harmonic app ...

The demise of Moore's Law and Dennard scaling has resulted in diminishing performance gains for general-purpose processors, and so has prompted a surge in academic and commercial interest for hardware accelerators. Specialized hardware has already redefine ...

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In laser based powder-bed fusion of metals (PBF-LB/M), parts are fabricated by melting layers of powder using a high-intensity laser beam. During this process, the material is exposed to rapid cooling rates and intense thermal gradients, which are the unde ...

High-speed turbomachinery is commonly designed to achieve high power densities. Limited space for active cooling results in a challenging thermal management. A thermal modeling approach leveraging modern declarative programming capabilities is presented, y ...

The presence of a ventilated air gap behind the external cladding in a building envelope is known to have a tangible contribution to the overall performance of the wall assembly. In the present study, the hydrodynamic and thermal performances of ventilated ...

The electrostatic screening properties of ionic fluids are of paramount importance in countless physical processes. Yet the screening behavior of ionic conductors out of thermal equilibrium has to date mainly been studied in the context of thermoelectric p ...

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

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Heat transport is an important, though often neglected function of gas diffusion layers (GDLs) of polymer electrolyte membrane fuel cells. Thermal conductivity is a key property, especially in partially water saturated GDLs and when the phase change of wat ...

Recent progress in understanding thermal transport in complex crystals has highlighted the prominent role of heat conduction mediated by interband tunneling processes, which emerge between overlapping phonon bands (i.e., with energy differences smaller tha ...

Computing servers play a key role in the development and process of emerging compute-intensive applications in recent years. However, they need to operate efficiently from an energy perspective viewpoint, while maximizing the performance and lifetime of th ...

A well-designed ventilated wall that incorporates air-space behind cladding can reduce energy use for conditioning buildings by adding a thermally resistive layer. The scarcity of thermal performance data and standardized test methods is a particular barri ...

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

Adaptive Task Migration Policies for Thermal control in MPSoCs

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Highly Parallel RTL Simulation

Innovative thermophysical characterization of an ATF composite cladding: the case of silicon carbide

Thermal conductivity of Li 3 PS 4 solid electrolytes with ab initio accuracy

Unearthing the foundational role of anharmonicity in heat transport in glasses

Building Chips Faster: Hardware-Compiler Co-Design for Accelerated RTL Simulation

Chaosity: Understanding Contemporary NUMA-architectures

Interlocking modular microfluidic cooling substrates for future high energy physics experiments

Exploring brain-inspired multi-core heterogeneous hardware templates for low-power biomedical embedded systems

Advancing efficiency and reliability in thermal analysis of laser powder-bed fusion

Thermal management for gas lubricated, high-speed turbomachinery

Experimental study of the hydrodynamic and thermal performances of ventilated wall structures

Effect of a temperature gradient on the screening properties of ionic fluids

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

Thermal Conditions in Indoor Environments: Exploring the Reasoning behind Standard-Based Recommendations

Full System Exploration of On-Chip Wireless Communication on Many-Core Architectures

Conductive Heat Transfer in Partially Saturated Gas Diffusion Layers with Evaporative Cooling

Many-body Green?s function approach to lattice thermal transport

Reinforcement Learning-Based Joint Reliability and Performance Optimization for Hybrid-Cache Computing Servers

Measuring the effective thermal resistance of ventilated air-spaces behind common wall assemblies: Theoretical uncertainty analysis and recommendations for the hot box method modifications (ASHRAE 1759-RP)

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation