Publications associées à Adaptive Task Migration Policies for Thermal control in MPSoCs

Highly Parallel RTL Simulation

Verification and testing of hardware heavily relies on cycle-accurate simulation of RTL. As single-processor performance is growing only slowly, conventional, single-threaded RTL simulation is becoming impractical for increasingly complex chip designs and ...

EPFL2024

Innovative thermophysical characterization of an ATF composite cladding: the case of silicon carbide

Andrea Cavaliere

Nuclear power is a powerful technology that plays an important role in the fight against climate change, and research is continuously engaged in studies that could further improve its safety. After the Fukushima accident, Accident Tolerant Fuels research h ...

EPFL2024

Thermal conductivity of Li 3 PS 4 solid electrolytes with ab initio accuracy

Michele Ceriotti, Federico Grasselli

The vast amount of computational studies on electrical conduction in solid-state electrolytes is not mirrored by comparable efforts addressing thermal conduction, which has been scarcely investigated despite its relevance to thermal management and (over)he ...

Amer Physical Soc2024

Unearthing the foundational role of anharmonicity in heat transport in glasses

The time-honored Allen -Feldman theory of heat transport in glasses is generally assumed to predict a finite value for the thermal conductivity, even if it neglects the anharmonic broadening of vibrational normal modes. We demonstrate that the harmonic app ...

Amer Physical Soc2024

Building Chips Faster: Hardware-Compiler Co-Design for Accelerated RTL Simulation

Sahand Kashani

The demise of Moore's Law and Dennard scaling has resulted in diminishing performance gains for general-purpose processors, and so has prompted a surge in academic and commercial interest for hardware accelerators. Specialized hardware has already redefine ...

EPFL2023

Chaosity: Understanding Contemporary NUMA-architectures

Anastasia Ailamaki, Viktor Sanca, Syed Mohammad Aunn Raza, Hamish Mcniece Hill Nicholson, Andreea Nica

Modern hardware is increasingly complex, requiring increasing effort to understand in order to carefully engineer systems for optimal performance and effective utilization. Moreover, established design principles and assumptions are not portable to modern ...

2023

Interlocking modular microfluidic cooling substrates for future high energy physics experiments

Massimo Angeletti

In high energy physics, semiconductor-based sensors are widely used in particle tracking applications. These sensors are typically glued on low-mass cooling substrates, which guarantee the correct thermal management and, at the same time, minimise their in ...

EPFL2023

Exploring brain-inspired multi-core heterogeneous hardware templates for low-power biomedical embedded systems

Benoît Walter Denkinger

The miniaturization of integrated circuits (ICs) and their higher performance and energy efficiency, combined with new machine learning algorithms and applications, have paved the way to intelligent, interconnected edge devices. In the medical domain, they ...

EPFL2023

Advancing efficiency and reliability in thermal analysis of laser powder-bed fusion

Christian Leinenbach, Thomas Mayer, Rafal Wróbel

In laser based powder-bed fusion of metals (PBF-LB/M), parts are fabricated by melting layers of powder using a high-intensity laser beam. During this process, the material is exposed to rapid cooling rates and intense thermal gradients, which are the unde ...

2023

Thermal management for gas lubricated, high-speed turbomachinery

Jürg Alexander Schiffmann, Luis Eric Olmedo Ocampo, Wei Liu, Wanhui Liu

High-speed turbomachinery is commonly designed to achieve high power densities. Limited space for active cooling results in a challenging thermal management. A thermal modeling approach leveraging modern declarative programming capabilities is presented, y ...

2023

Experimental study of the hydrodynamic and thermal performances of ventilated wall structures

Mohammad Rahiminejad, Dolaana Khovalyg

The presence of a ventilated air gap behind the external cladding in a building envelope is known to have a tangible contribution to the overall performance of the wall assembly. In the present study, the hydrodynamic and thermal performances of ventilated ...

2023

Effect of a temperature gradient on the screening properties of ionic fluids

Andrea Grisafi, Federico Grasselli

The electrostatic screening properties of ionic fluids are of paramount importance in countless physical processes. Yet the screening behavior of ionic conductors out of thermal equilibrium has to date mainly been studied in the context of thermoelectric p ...

AMER PHYSICAL SOC2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Thermal Conditions in Indoor Environments: Exploring the Reasoning behind Standard-Based Recommendations

Dolaana Khovalyg

Professionals in the building design and operation fields typically look at standards and guidelines as a reliable source of information and guidance with regard to procedural, contractual, and legal scope and requirements that are relevant to accountabili ...

2023

Full System Exploration of On-Chip Wireless Communication on Many-Core Architectures

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Yasir Mahmood Qureshi, Joshua Alexander Harrison Klein, Rafael Medina Morillas

In order to develop sustainable and more powerful information technology (IT) infrastructures, the challenges posed by the "memory wall" are critical for the design of high-performance and high-efficiency many-core computing systems. In this context, recen ...

IEEE2022

Conductive Heat Transfer in Partially Saturated Gas Diffusion Layers with Evaporative Cooling

Sophia Haussener, Mirco Magnini, Felix N. Büchi

Heat transport is an important, though often neglected function of gas diffusion layers (GDLs) of polymer electrolyte membrane fuel cells. Thermal conductivity is a key property, especially in partially water saturated GDLs and when the phase change of wat ...

2022

Many-body Green?s function approach to lattice thermal transport

Nicola Marzari, Michele Simoncelli

Recent progress in understanding thermal transport in complex crystals has highlighted the prominent role of heat conduction mediated by interband tunneling processes, which emerge between overlapping phonon bands (i.e., with energy differences smaller tha ...

AMER PHYSICAL SOC2022

Reinforcement Learning-Based Joint Reliability and Performance Optimization for Hybrid-Cache Computing Servers

David Atienza Alonso, Ali Pahlevan, Marina Zapater Sancho, Luis Maria Costero Valero, Darong Huang

Computing servers play a key role in the development and process of emerging compute-intensive applications in recent years. However, they need to operate efficiently from an energy perspective viewpoint, while maximizing the performance and lifetime of th ...

2022

Measuring the effective thermal resistance of ventilated air-spaces behind common wall assemblies: Theoretical uncertainty analysis and recommendations for the hot box method modifications (ASHRAE 1759-RP)

Mohammad Rahiminejad, Dolaana Khovalyg

A well-designed ventilated wall that incorporates air-space behind cladding can reduce energy use for conditioning buildings by adding a thermally resistive layer. The scarcity of thermal performance data and standardized test methods is a particular barri ...

2022

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022