Publications associées à Repeater Insertion for Two-Terminal Nets in Three-Dimensional Integrated Circuits

A modular multiple frequency inductive link to wirelessly power multiple miniaturized implants

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A modular multiple frequency coils inductive link system to wirelessly provide power for at least a medical implant at an output of a receiving coil, whereby the receiving coil is configured to be implanted in an organism. The modular multiple frequency co ...

2024

Advanced Silicon and SWIR Single-Photon Avalanche Diodes: Design, Simulation, and Characterization

Ekin Kizilkan

Low-level light detection with high spatial and timing accuracy is a growing area of interest by virtue of applications such as light detection and ranging (LiDAR), biomedical imaging, time-resolved Raman spectroscopy, and quantum applications. Single-phot ...

EPFL2024

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

Thermal and Power-Aware Run-Time Performance Management of 3D MPSoCs with Integrated Flow Cell Arrays

David Atienza Alonso, Halima Najibi, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse

Flow Cell Arrays (FCA) technology employs microchannels filled with an electrolytic fluid to concurrently provide cooling and power generation to integrated circuits (ICs). This solution is particularly appealing for Three-Dimensional Multi-Processor Syste ...

2022

A Deep-Learning Approach to Side-Channel Based CPU Disassembly at Design Time

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Side-channel CPU disassembly is a side-channel attack that allows an adversary to recover instructions executed by a processor. Not only does such an attack compromise code confidentiality, it can also reveal critical information on the system’s internals. ...

IEEE2022

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

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Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

A novel approach for SPICE modeling of light and radiation effects in ICs

Chiara Rossi

Modeling the interaction of ionizing radiation, either light or ions, in integrated circuits is essential for the development and optimization of optoelectronic devices and of radiation-tolerant circuits. Whereas for optical sensors photogenerated carriers ...

EPFL2021

Resource Trade-Offs in Circuits and Systems: from Neurotechnology to Communications

Arda Uran

This thesis aims to explore and exploit trade-offs in integrated circuits and systems to overcome the fundamental bottlenecks faced by future data acquisition and communication systems. Specifically, we target the emerging implantable neurotechnology and t ...

EPFL2021

Embedded Microchannel Cooling for Monolithically-integrated GaN Half-bridge ICs

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Efficient and compact power conversion is a key requirement to achieve sustainable electrification of our society. GaN-based power devices offer major benefits compared to their silicon counterparts in terms of efficiency and integration but suffer from se ...

IEEE2021

Characterization and Modeling of Total Ionizing Dose Effects on Nanoscale MOSFETs for Particle Physics Experiments

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Total ionizing radiation compromises electrical characteristics of microelectronic devices and even causes functional failures of integrated circuits. It has been identified as a potential threat to electronic components, especially those in high-energy ph ...

EPFL2021

Cryogenic MOSFET Modeling for Large-Scale Quantum Computing

Arnout Lodewijk M Beckers

Promising results of state-of-the-art quantum computers fuel a world-wide effort in academic and private research laboratories to scale up the number of qubits and improve their characteristics in large arrays. To meet the scale-up challenge, innovative mi ...

EPFL2021

Ultra-compact, high-frequency power integrated circuits based on GaN-on-Si Schottky Barrier Diodes

Elison de Nazareth Matioli, Jun Ma, Georgios Kampitsis, Remco Franciscus Peter van Erp, Luca Nela

GaN transistors are being employed in an increasing number of applications thanks to their excellent performance and competitive price. Yet, GaN diodes are not commercially available and little is known about their performance and potential impact on power ...

2020

Energy- and Cost-Efficient VLSI DSP Systems Design with Approximate Computing

Reza Ghanaatian Jahromi

Technology scaling has progressed to enable integrated circuits with extremely high density enabling systems of tremendous complexity with manageable power consumption. With the continuation of Moore's law for many years, electronic chips have been able to ...

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InAs-on-Insulator Fin Nanostructures for Integrated Computation and Sensing Functions

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Field-effect transistors (FETs) have established themselves as a leading platform for electrical detection of chemical and biological species. Their advantages over other optical, mechanical sensing platforms are attributed to being miniaturizable, mechani ...

EPFL2020

Visual Attention and Perceptual Quality in Omnidirectional Imaging

Evgeniy Upenik

Omnidirectional imaging has reached a level of widespread availability driven by recent advances in integrated circuit technology, image sensors, and computer graphics which allow now capturing, rendering and displaying of such type of immersive content in ...

EPFL2020

Three-dimensional imaging of integrated circuits with macro- to nanoscale zoom

Christian David, Michal Odstrcil, Gabriel Aeppli, Manuel Guizar Sicairos

The imaging of integrated circuits across different length scales is required for failure analysis, design validation and quality control. At present, such inspection is accomplished using a hierarchy of different probes, from optical microscopy on the mil ...

NATURE PUBLISHING GROUP2019

A high sensitivity low-power capacitive front-end for insulin injection pens

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A low-power 14-bits first order incremental Analog-to-Digital Converter (ADC) is presented. Based on the charge balancing principle, this switched-capacitor (SC) circuit integrates the input signal multiple times to reach the targeted resolution, linearity ...

ELSEVIER SCI LTD2019

ReRAM From Material Study to CMOS Co-integration

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The revolution of information-technology owes to silicon-based complementary-metal-oxide (CMOS) technology. However, CMOS technology approaches its physical limitation hardening the further progress of memory devices as well as computing paradigm requiring ...

EPFL2019

System Design and Advanced Circuit Techniques for Bi-Directional Brain-Machine Interfaces

Wen-Yang Hsu

Bi-directional brain-machine interfaces (BBMIs) that can capture electrophysiological signals and provide feedback through electrical stimulation are emerging tools with various applica-tions in fundamental neuroscience research as well as in clinical trea ...

EPFL2018

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018