Publication

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Publications associées (32)

Learned Compressive Representations for Single-Photon 3D Imaging

Claudio Bruschini, Edoardo Charbon, Andrei Ardelean, Mohit Gupta

Single-photon 3D cameras can record the time-of-arrival of billions of photons per second with picosecond accuracy. One common approach to summarize the photon data stream is to build a per-pixel timestamp histogram, resulting in a 3D histogram tensor that ...

Ieee Computer Soc2023

Performance investigation of cameras using HDR sensors for daylight glare evaluations

Jan Wienold, Geraldine Cai Ting Quek, Dong Hyun Kim

This study presents a novel framework for evaluating the luminance measurement capabilities of High Dynamic Range (HDR) sensor cameras in indoor glare conditions. Results indicate that the practical usage range of the CSEM VIP camera is significantly lower ...

International Commission on Illumination2023

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Duccio Testa, Ambrine Douhane, Marcus Cemes

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

2023

Electronic readout of DNA amplification in nanoliter chambers. Strategies towards highly parallel semiconductor-based nucleic acid amplification testing

Saurabh Tomar

Polymerase chain reaction (PCR) has been the most significant driver in the field of nucleic acid testing (NAT) since its invention. Popularized as an abbreviation by the Covid-19 pandemic, PCR-based methods are the gold standard in the field of diagnostic ...

EPFL2023

Third-harmonic generation monitoring of femtosecond-laser-induced in-volume functional modifications

Christian Enz, Yves Bellouard, Olivier Bernard, Assim Boukhayma, Andrea Kraxner

During the last two decades, ultrafast in-volume laser-based processing of transparent materials has emerged as a key 3D-printing method for manufacturing a variety of complex integrated photonic devices and micro-parts. Yet, identifying suitable laser pro ...

2023

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

Optimizing in-situ monitoring for laser powder bed fusion process: Deciphering acoustic emission and sensor sensitivity with explainable machine learning

Christian Leinenbach, Rafal Wróbel, Sergey Shevchik

Metal-based Laser Powder Bed Fusion (LPBF) has made fabricating intricate components easier. Yet, assessing part quality is inefficient, relying on costly Computed Tomography (CT) scans or time-consuming destructive tests. Also, intermittent inspection of ...

Elsevier Science Sa2023

Interlocking modular microfluidic cooling substrates for future high energy physics experiments

Massimo Angeletti

In high energy physics, semiconductor-based sensors are widely used in particle tracking applications. These sensors are typically glued on low-mass cooling substrates, which guarantee the correct thermal management and, at the same time, minimise their in ...

EPFL2023

Miniaturised, Wireless and Distributed Neural Interface Toward Cortical Visual Prosthesis

Gian Luca Barbruni

Over the last decades, implantable neural interfaces have been extensively explored and effectively deployed to address neurological and mental health disorders. The existing solutions present several limitations. Firstly, the physical size of the implanta ...

EPFL2023

A 500 x 500 Dual-Gate SPAD Imager With 100% Temporal Aperture and 1 ns Minimum Gate Length for FLIM and Phasor Imaging Applications

Claudio Bruschini, Edoardo Charbon, Arin Can Ülkü, Andrei Ardelean, Paul Mos, Michael Alan Wayne

In this article, we report on SwissSPAD3 (SS3), a 500 x 500 pixel single-photon avalanche diode (SPAD) array, fabricated in 0.18-mu m CMOS technology. In this sensor, we introduce a novel dual-gate architecture with two contiguous temporal windows, or gate ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

Medipix4, a high granularity four sides buttable pixel readout chip for high resolution spectroscopic X-ray imaging at rates compatible with medical CT scans

Viros Sriskaran

Medipix4 is the latest member in the Medipix/Timepix family of pixel detector chips aimed at high rate spectroscopic X-ray imaging using high-Z materials. The chip address the limitations of conventional hybrid pixel detectors for X-ray imaging. Its predec ...

EPFL2022

High-Performance CMOS SPAD-Based Sensors for Time-of-Flight PET Applications

Francesco Gramuglia

Detecting light, photon by photon, has been possible since the 1930s, with the invention of the photomultiplier tube (PMT). However, it is only since the 1970s, that solid-state single-photon detectors have emerged and only since 2003 that a new technology ...

EPFL2022