Thermal-Aware Design of of 3D ICs with Inter-Tier Liquid Cooling

À propos
Confidentialité
Mentions légales

Graph Chatbot

Publications associées (32)

Evaluation of HPK n plus -p planar pixel sensors for the CMS Phase-2 upgrade

Rakesh Chawla, Albert Perez, François Robert, Andrea Rizzi, Martin Fuchs, Stefano Michelis, Alexis Kalogeropoulos, Varun Sharma, Davide Ceresa, Ashish Sharma, David Vannerom, David Parker, Alessandro Caratelli, Thomas Muller, Yong Yang, Kai Yi, Andromachi Tsirou, Georgios Anagnostou, Konstantin Androsov, Ajay Kumar, Werner Lustermann, Xin Chen, Jing Li

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determine ...

Elsevier2023

Compilation and Design Space Exploration of Dataflow Programs for Heterogeneous CPU-GPU Platforms

Aurélien François Gilbert Bloch

Today's continued increase in demand for processing power, despite the slowdown of Moore's law, has led to an increase in processor count, which has resulted in energy consumption and distribution problems. To address this, there is a growing trend toward ...

EPFL2023

Full System Exploration of On-Chip Wireless Communication on Many-Core Architectures

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Yasir Mahmood Qureshi, Joshua Alexander Harrison Klein, Rafael Medina Morillas

In order to develop sustainable and more powerful information technology (IT) infrastructures, the challenges posed by the "memory wall" are critical for the design of high-performance and high-efficiency many-core computing systems. In this context, recen ...

IEEE2022

Thermal and Voltage-Aware Performance Management of 3D MPSoCs with Flow Cell Arrays and Integrated SC Converters

David Atienza Alonso, Halima Najibi, Giovanni Ansaloni, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse

Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and electrochemical power generation. This technology is especially promising for three-dimensional multi-processor systems-on-chip (3D MPSoCs) realized in deeply scaled technolo ...

2022

Piezoelectric suspended microchannel resonators

Damien Maillard

The objective of this PhD thesis is the development of a microfluidic platform for the real-time measurements of the mechanical properties of biological analytes at the single entity level. The systems developed for these purposes consist of piezoelectrica ...

EPFL2022

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

Development of a large-area, light-weight module using the MALTA monolithic pixel detector

Edoardo Charbon, Ashish Sharma, Francesco Piro

The MALTA pixel chip is a 2 cm x 2 cm large monolithic pixel detector developed in the Tower 180 nm imaging process. The chip contains four CMOS transceiver blocks at its sides which allow chip-to-chip data transfer. The power pads are located mainly at th ...

ELSEVIER2022

FPGA-to-CPU Undervolting Attacks

Mirjana Stojilovic, Dina Gamaleldin Ahmed Shawky Mahmoud

FPGAs are proving useful and attractive for many applications, thanks to their hardware reconfigurability, low power, and high-degree of parallelism. As a result, modern embedded systems are often based on systems-on-chip (SoCs), where CPUs and FPGAs share ...

IEEE2022

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Reinforcement Learning-Based Joint Reliability and Performance Optimization for Hybrid-Cache Computing Servers

David Atienza Alonso, Ali Pahlevan, Marina Zapater Sancho, Luis Maria Costero Valero, Darong Huang

Computing servers play a key role in the development and process of emerging compute-intensive applications in recent years. However, they need to operate efficiently from an energy perspective viewpoint, while maximizing the performance and lifetime of th ...

2022

Medipix4, a high granularity four sides buttable pixel readout chip for high resolution spectroscopic X-ray imaging at rates compatible with medical CT scans

Viros Sriskaran

Medipix4 is the latest member in the Medipix/Timepix family of pixel detector chips aimed at high rate spectroscopic X-ray imaging using high-Z materials. The chip address the limitations of conventional hybrid pixel detectors for X-ray imaging. Its predec ...

EPFL2022

Self-heating analysis of monolithically integrated hybrid III-V/Si PIN diode

Kirsten Emilie Moselund

Self-heating is a crucial effect in integrated nanophotonic devices regarding their power consumption. In this work, we employ coupled 3D thermo-electrical simulations to gain insight into the thermal behavior related to traps in a monolithic InP-InGaAs-In ...

SPIE-INT SOC OPTICAL ENGINEERING2022

Page 2 sur 2