Publication

Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor

Martinus Adela Maria Gijs, Christophe Yamahata, Marc Stranczl
2011
Conference Papers

Résumé

We present the design, modeling and characterization of a 3-phase electrostatic rotary stepper micromotor. The proposed motor is a monolithic device fabricated using silicon-on-insulator (SOI) technology. The rotor is suspended with a frictionless flexural pivot bearing and reaches an unprecedented rotational range of 30° (+/- 15°) at 65 V. We have established a mechanical model of the deformation structure and performed finite element analysis (FEA) simulations of the dynamic properties. These studies are consistent with the extensive experimental characterization performed in the quasi-static, transient, and dynamic regimes.

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https://infoscience.epfl.ch/entities/publication/879a640e-6f97-4473-a16f-42a5d924f762

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Martinus Adela Maria Gijs, Christophe Yamahata, Marc Stranczl
2011
Conference Papers

Résumé

Source officielle

https://infoscience.epfl.ch/entities/publication/879a640e-6f97-4473-a16f-42a5d924f762

À propos de ce résultat

Concepts associés (25)

Three-dimensional integrated circuit

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

Hybrid integrated circuit

A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.

Deformation (engineering)

In engineering, deformation refers to the change in size or shape of an object. Displacements are the absolute change in position of a point on the object. Deflection is the relative change in external displacements on an object. Strain is the relative internal change in shape of an infinitesimally small cube of material and can be expressed as a non-dimensional change in length or angle of distortion of the cube. Strains are related to the forces acting on the cube, which are known as stress, by a stress-strain curve.

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Modal analysis and modeling of a frictionless electrostatic rotary stepper micromotor

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