Publication

On-Chip Cooling of Hot-Spots with a Copper Micro-Evaporator

Publications associées (27)

First steps towards interlocking modular microfluidic cooling substrates (i-MμCS) for future silicon tracking detectors in High Energy Physics (HEP)

In future High Energy Physics detectors, the coverage of large surfaces with silicon pixel chip sensors poses a challenge for the sensors positioning, for their cooling, assembly, and interconnection. The use of a cooling substrate on which the sensors are ...

2022

80 K cryogenic stage for ice lithography

Danick Briand, Rubaiyet Iftekharul Haque, Jaemin Kim

We present a cryogenic system design and development for ice lithography. The cryo-stage is designed with embedded channels to allow direct liquid nitrogen flow, enabling fast cryogenic cooling, and low sample temperature. The stage cools down to 78.8 K in ...

ELSEVIER2022

A parametric study on pool boiling heat transfer and critical heat flux on structured surfaces with artificial cavities

Luis Guillermo Villanueva Torrijo, Ahmad Reza Motezakker

Emerging applications in new generation electronic devices require effective heat removal and thermal man-agement. In this regard, boiling is a phase change phenomenon capable of dissipating a large amount of heat compared to the sensible heat. In this stu ...

PERGAMON-ELSEVIER SCIENCE LTD2022

Operational Map And Thermal Performance Of A Thermosyphon Cooling System For Compact Servers

John Richard Thome, Jackson Braz Marcinichen, Raffaele Luca Amalfi, Filippo Cataldo

This paper advances the state-of-the-art in novel passive two-phase systems for more efficient cooling of datacenters and telecom central offices compared to the traditional air-based cooling solutions (e.g. aisle-based containment systems). The proposed p ...

AMER SOC MECHANICAL ENGINEERS2021

Thermal management of components for high energy physics experiments and space applications

Timothée Robert Sophus Frei

High-energy physics (HEP) experiments and space missions share a common challenge: thermal management in harsh environments. The severe constraints in both fields make cooling of electronic components a major design concern. This thesis aims to develop hig ...

EPFL2021

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

John Richard Thome, Jackson Braz Marcinichen, Raffaele Luca Amalfi, Filippo Cataldo

Passive, gravity-driven thermosyphons represent a stepchange in technology towards the goal of greatly reducing PUE (Power Usage Effectiveness) of datacenters by replacing energy hungry fans of air-cooling approach with a highly-reliable solution able to d ...

AMER SOC MECHANICAL ENGINEERS2021

Multiphase transport and evaporative cooling in fuel cell gas diffusion layers

Sarah van Rooij

The use of evaporative cooling in the gas diffusion layer (GDL) of polymer electrolyte fuel cells has been proposed as a simple yet impactful solution to simultaneously provide the functionality of cell cooling, thanks to the dissipation of the latent heat ...

EPFL2021