Influence of the mould thermal expansion on composite stress build-up during curing

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Semiconductor materials have given rise to today's digital technology and consumer electronics. Widespread adoption is closely linked to the ability to process and integrate them in devices at scale. Where flexibility and large surfaces are required, such ...

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We seek to address how air entrapment mechanisms during infiltration are influenced by the wetting characteristics of the fluid and the pore network formed by the reinforcement. To this end, we evaluated the behavior of two model fluids with different surf ...

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CRACK SHIELDING MECHANISMS OF INTERLAYERED EPOXY MATERIALS UNDER QUASI-STATIC AND FATIGUE LOADING

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The lack of ductility is a major drawback of fibre reinforced polymer (FRP) materials. As it is known, these materials are stiff and strong, but brittle with little or no warning before final failure. In the last decades, some solutions have been proposed ...

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