Publications associées à Overview on low temperature co-fired ceramic sensors

Graph generative deep learning models with an application to circuit topologies

Modern integrated circuits are tiny yet incredibly complex technological artifacts, composed of millions and billions of individual structures working in unison. Managing their complexity and facilitating their design drove part of the co-evolution of mode ...

EPFL2024

Additive and digital manufacturing of transient sensors and bioelectronics

Nicolas Francis Fumeaux

Transient electronics have emerged as a promising class of devices, capable of breaking down without harmful side effects to their environment. They have tremendous potential as bioresorbable electronics for temporary applications in the human body, and as ...

EPFL2023

Printed ecoresorbable temperature sensors for environmental monitoring

Danick Briand, James Alec Pierce Bourely, Nicolas Francis Fumeaux, Melissa Kossairi

Electronic waste has become a pressing issue, necessitating sustainable solutions for the disposal of electronic devices. While the development of environmentally degradable electronics has gained attention, the fabrication of stable and performant sensors ...

2023

Integrated Electronics for Deep Implants to Remotely Monitor Hemodynamics

Mustafa Besirli

The integration of technology in the medical field has greatly improved accuracy in diagnoses, thus leading to more effective treatments. Wearable and implantable medical devices offer great potential for remote patient monitoring, particularly for heart f ...

EPFL2023

Dataset for "Low-temperature processing of screen-printed piezoelectric KNbO3 with integration onto biodegradable paper substrates"

Luis Guillermo Villanueva Torrijo, Danick Briand, Morgan Mc Kay Monroe

This data set contains the data collected during the FNS project Green Piezo (Grant no. 179064) in association with the recent publication entitled “Low-temperature processing of screen-printed piezoelectric KNbO3 with integration onto biodegradable paper ...

Zenodo2023

Electronic metadevices for terahertz applications

Elison de Nazareth Matioli, Mohammad Samizadeh Nikooytabalvandani

The evolution of electronics has largely relied on downscaling to meet the continuous needs for faster and highly integrated devices(1). As the channel length is reduced, however, classic electronic devices face fundamental issues that hinder exploiting ma ...

NATURE PORTFOLIO2023

Exploring brain-inspired multi-core heterogeneous hardware templates for low-power biomedical embedded systems

Benoît Walter Denkinger

The miniaturization of integrated circuits (ICs) and their higher performance and energy efficiency, combined with new machine learning algorithms and applications, have paved the way to intelligent, interconnected edge devices. In the medical domain, they ...

EPFL2023

A Sprayable Electrically Conductive Edible Coating for Piezoresistive Strain Sensing

Dario Floreano, Pietro Rossi, Bokeon Kwak

Edible electronics leverages the electronic properties of food-derived materials to deliver safer technologies that can be degraded (or digested) in the environment (or body) at the end-of-life. Sensors will be central to future smart edible robots, and ed ...

2024

A hybrid Selective Laser Sintering based process for the additive manufacturing of architectured composites

Erwan Philippe Guenier

Additive Manufacturing also commonly referred as 3D printing has been given a lot of interest lately. Market is growing exponentially and the aim for obtaining more complex and ready-to use parts is emerging. All the 3D printing processes consist in buildi ...

EPFL2023

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

Source Reconstruction Method Using Phase-Less Magnetic Near-Field Measurements: Application of the Method of Moment with Roof-Top Basis Functions

Marcos Rubinstein, Hamidreza Karami

Source reconstruction methods have many applications such as antenna diagnosis, calculating far-field radiated emissions, and identifying incompatible sources on integrated circuits or printed circuit boards. In this paper, the Gerchberg-Saxton algorithm i ...

IEEE2022

EMC Impact of Disturbances Generated by Multiple Sources

Farhad Rachidi-Haeri, Marcos Rubinstein, Hamidreza Karami

In this paper, the impact of an increasing number of arbitrary electrical/electronic devices on the overall radiated emissions is investigated. Understanding and quantifying such an impact are prerequisites to the proper evaluation of electromagnetic compa ...

2022

Design and printing of a coplanar capacitive proximity sensor to detect the gap between dielectric foils edges

Danick Briand, Rubaiyet Iftekharul Haque, Martin Lubej

This paper presents the design and development of a coplanar capacitive proximity sensor for the detection of the gap between the edges of dielectric foils. The finite element analysis is applied to study the design of the sensor by investigating the effec ...

2022

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

A Battery-Free Wireless Smart Sensor platform with Bluetooth Low Energy Connectivity for Smart Agriculture

Catherine Dehollain, Roberto La Rosa

Smart agriculture systems, which integrate sensors and data analysis into agricultural production processes, are increasingly proving an effective solution for reducing food production waste, yield production increase, and product quality improvement. In t ...

IEEE2022

Characterization and Modeling of Total Ionizing Dose Effects on Nanoscale MOSFETs for Particle Physics Experiments

Chunmin Zhang

Total ionizing radiation compromises electrical characteristics of microelectronic devices and even causes functional failures of integrated circuits. It has been identified as a potential threat to electronic components, especially those in high-energy ph ...

EPFL2021

An Energy-Autonomous Wireless Sensor With Simultaneous Energy Harvesting and Ambient Light Sensing

Catherine Dehollain, Andreas Peter Burg, Roberto La Rosa

Wireless sensor nodes (WSNs) are generally powered by batteries, which results in a substantial limitation to the places where the nodes can be installed, to the maximum number of deployable devices, and to the node lifetime. To meet the demand for Interne ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2021

A Self-powered Ambient Light Power Measurement Platform with Time-domain Readout

Catherine Dehollain, Roberto La Rosa

Internet of Things (IoT) provides more and more adequate infrastructures for many applications and advanced services. This scenario promotes the ability to satisfy the growing demand for innovative measuring systems, increasingly popular consisting of inte ...

IEEE2021

2D Material Based Inks For Room Temperature Printed Electronics

Sina Abdolhosseinzadeh

Functional printing is a versatile mass production method that has gained considerable scientific and industrial attention in the past few years. A wide range of electronics from passive circuit components (e.g., resistors and interconnects) to high-perfor ...

EPFL2021

In-situ laser sintering for the fabrication of fully 3D printed electronics composed of elastomeric materials

Danick Briand, Sébastien Lani, Olivier Rémy Henry Chandran, Rubaiyet Iftekharul Haque, Ryan Mitchell van Dommelen

In-situ laser sintering can be used to locally sinter conductive inks in an uninterrupted process, enabling the embedding of printed electronics within 3D printed structures. In this work we apply a laser sintering method to create highly conductive silver ...

2021