Publications associées à Design Methods and Tools for 3D Integration

Publications associées (27)

Teaching Not To

Two design studios were successively taught in two schools of architecture: one at the Harvard Graduate School of Design (GSD) and the other at the Swiss Federal Institute of Technology in Lausanne (EPFL) in Lausanne, Switzerland, based on "A Global Morato ...

Taylor & Francis Inc2024

Course Design - A Visual and Modular Approach

Marc Laperrouza

This book has been designed for instructors in higher education or adult training who wish to develop a new course or revise an existing one. It adopts a practical, visual, and modular approach based on the principle of constructive alignment. At its heart ...

EPFL Press2024

Technology-Aware Logic Synthesis for Superconducting Electronics

Giovanni De Micheli, Alessandro Tempia Calvino, Siang-Yun Lee, Dewmini Sudara Marakkalage, Mingfei Yu, Rassul Bairamkulov

Superconducting electronics provide us with cryogenic digital circuits that can rival established technologies in performance and energy consumption. Today, the lack of tools for the design of large-scale integrated superconducting circuits is a major obst ...

2024

The Current State of the OBI DICT Project: A Bilingual e-Dictionary of Oracle-Bone Inscriptions with AI Image Recognition

Shuo Wen

This article reports on the current state of the OBI DICT project, a bilingual e-dictionary of oracle-bone inscriptions (OBI), incorporating artificial intelligence (AI) image recognition technology. It first provides a brief overview of the development of ...

Buro Van Die Wat2024

Surface segregation in high-entropy alloys from alchemical machine learning

Michele Ceriotti, Sandip De, Guillaume André Jean Fraux, Arslan Mazitov, Nataliya Lopanitsyna

High-entropy alloys (HEAs), containing several metallic elements in near-equimolar proportions, have long been of interest for their unique mechanical properties. More recently, they have emerged as a promising platform for the development of novel heterog ...

Iop Publishing Ltd2024

Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

An explorative method to support design decisions based on carbon constraints and daylight sufficiency needs

Nazanin Rezaei Oghazi

The global construction industry contributes to 37% of carbon emissions associated to both building operations and construction. To help achieve the net-zero targets set by 2050, it is mandated to achieve a 50% reduction in carbon emissions by 2030. As we ...

EPFL2024

A Dual-Channel Gate Driver Design with Active Voltage Balancing Circuit for Series Connection of SiC MOSFETs

Drazen Dujic, Rui Wang

Dual-channel gate driver is commonly utilized in the industry for accommodating the widespread use of half-bridge power modules. As wide-bandgap devices become increasingly prevalent due to their superior switching characteristics compared with conventiona ...

2024

3D diffractive optics for linear interconnects and nonlinear processing

Niyazi Ulas Dinç

The optical domain presents potential avenues for enhancing both computing and communication due to its inherent properties of bandwidth, parallelism, and energy efficiency. This research focuses on harnessing 3-Dimensional (3D) diffractive optics for nove ...

EPFL2024

Advanced Silicon and SWIR Single-Photon Avalanche Diodes: Design, Simulation, and Characterization

Ekin Kizilkan

Low-level light detection with high spatial and timing accuracy is a growing area of interest by virtue of applications such as light detection and ranging (LiDAR), biomedical imaging, time-resolved Raman spectroscopy, and quantum applications. Single-phot ...

EPFL2024

3D Printing of Customizable Transient Bioelectronics and Sensors

Danick Briand, Nicolas Francis Fumeaux

Transient electronics have emerged as a new category of devices that can degrade after their functional lifetime, offering tremendous potential as disposable sensors, actuators, wearables, and implants. Additive manufacturing methods represent a promising ...

2024

A diversity-driven discovery of potential nanoporous materials for energy-related applications

Sauradeep Majumdar

The design and discovery of potential novel materials is critical for the advancement of climate change mitigation technologies. In this respect, metal-organic frameworks (MOFs) have received considerable attention over the last two decades. The combinatio ...

EPFL2024

Co-Design Optimisation of Morphing Topology and Control of Winged Drones

Dario Floreano, Valentin Wüest

The design and control of winged aircraft and drones is an iterative process aimed at identifying a compromise of mission-specific costs and constraints. When agility is required, shape-shifting (morphing) drones represent an efficient solution. However, m ...

IEEE2024

TSLAM: a tag-based object-centered monocular navigation system for augmented manual woodworking

Yves Weinand, Julien Gamerro, Andrea Settimi, Hong-Bin Yang

TimberSLAM (TSLAM) is an object-centered, tag-based visual self-localization and mapping (SLAM) system for monocular RGB cameras. It was specifically developed to support a robust and augmented reality pipeline for close-range, noisy, and cluttered fabrica ...

2024

Strategy to systematically design and deploy the ITER plasma control system: A system engineering and model-based design approach

Richard Pitts, Federico Alberto Alfredo Felici, Federico Pesamosca, Anna Ngoc Minh Trang Vu

The paper details the process of developing the ITER Plasma Control System (PCS), that is, how to design and deploy it systematically, in the most efficient and effective manner. The integrated nature of the ITER PCS, with its multitude of coupled control ...

Elsevier Science Sa2024

Design ontology for cognitive thread supporting traceability management in model-based systems engineering

Dimitrios Kyritsis, Jinzhi Lu, Yan Yan

Industrial information integration engineering (IIIE) is an interdisciplinary field to facilitate the industrial information integration process. In the age of complex and large-scale systems, model-based systems engineering (MBSE) is widely adopted in ind ...

Elsevier2024

An aircraft assembly process formalism and verification method based on semantic modeling and MBSE

Dimitrios Kyritsis, Jinzhi Lu, Xiaochen Zheng

The aircraft assembly system is highly complex involving different stakeholders from multiple domains. The design of such a system requires comprehensive consideration of various industrial scenarios aiming to optimize key performance indicators. Tradition ...

Elsevier Sci Ltd2024

Modular segmentation, spatial analysis and visualization of volume electron microscopy datasets

Martin Weigert

Volume electron microscopy is the method of choice for the in situ interrogation of cellular ultrastructure at the nanometer scale, and with the increase in large raw image datasets generated, improving computational strategies for image segmentation and s ...

Nature Portfolio2024

Modeling and optimization of PCB coils for inductive power transfer systems

Xiaotong Du

The auxiliary power supply for medium voltage converters requires high insulation capability between the source and the load. Inductive power transfer technology, with an air gap between the primary and secondary coil, offers such high insulation capabilit ...

EPFL2024

Lithium tantalate photonic integrated circuits for volume manufacturing

Tobias Kippenberg, Johann Emmeram Riemensberger, Mikhail Churaev, Xinru Ji, Zihan Li, Terence Albert Emile Blésin, Chengli Wang, Junyin Zhang, Xi Wang, Chen Yang, Wil Kao, Alisa Davydova

Electro-optical photonic integrated circuits (PICs) based on lithium niobate (LiNbO3) have demonstrated the vast capabilities of materials with a high Pockels coefficient1,2. They enable linear and high-speed modulators operating at complementary metal–oxi ...

2024