Publications associées à Method for manufacturing hybrid soft-rigid electronic devices

Publications associées (33)

Direct laser writing of electronically conductive microstructures within soft hydrogel substrates

Veronica Navello, Stéphanie Lacour, Esther Amstad, Outman Akouissi, Lorenzo Lucherini

Hydrogels have emerged as promising materials for bioelectronic interfaces due to their tissue-like properties and high-water content. However, conventional hydrogels often suffer from poor electrical conductivity and mechanical stability, limiting their p ...

2025

Plasma-irradiated hafnia ferroelectrics for high-performance flexible thin film transistors

Arindam Bala

Integrating unconventional HfO2-based ferroelectrics in thin film transistors (TFTs) has proven effective in enhancing performance by stabilizing negative capacitance (NC). This is achieved by incorporating the ferroelectric in series with a high-permittiv ...

2025

Graph generative deep learning models with an application to circuit topologies

Igor Krawczuk

Modern integrated circuits are tiny yet incredibly complex technological artifacts, composed of millions and billions of individual structures working in unison. Managing their complexity and facilitating their design drove part of the co-evolution of mode ...

EPFL2024

Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration

Zhenyu Wang

In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...

EPFL2024

Additive and digital manufacturing of transient sensors and bioelectronics

Nicolas Francis Fumeaux

Transient electronics have emerged as a promising class of devices, capable of breaking down without harmful side effects to their environment. They have tremendous potential as bioresorbable electronics for temporary applications in the human body, and as ...

EPFL2023

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

New ultrahigh-speed device concepts: from THz nanoplasma devices to glass-like electronics for neuromorphic computation

Mohammad Samizadeh Nikooytabalvandani

There is a never-ending push for electronic systems to provide faster operation speeds, higher energy efficiencies, and higher power capabilities at smaller scales. These requirements are apparent in different areas of electronics, from radiofrequency (RF) ...

EPFL2023

A Sprayable Electrically Conductive Edible Coating for Piezoresistive Strain Sensing

Dario Floreano, Bokeon Kwak

Edible electronics leverages the electronic properties of food-derived materials to deliver safer technologies that can be degraded (or digested) in the environment (or body) at the end-of-life. Sensors will be central to future smart edible robots, and ed ...

Wiley2024

A hybrid Selective Laser Sintering based process for the additive manufacturing of architectured composites

Erwan Philippe Guenier

Additive Manufacturing also commonly referred as 3D printing has been given a lot of interest lately. Market is growing exponentially and the aim for obtaining more complex and ready-to use parts is emerging. All the 3D printing processes consist in buildi ...

EPFL2023

Biocompatible and Biodegradable 3D Printing from Bioplastics: A Review

Sandro Carrara

There has been a lot of interest in developing and producing biodegradable polymers to address the current environmental problem caused by the continued usage of synthetic polymers derived from petroleum products. Bioplastics have been identified as a poss ...

MDPI2023

How to Make Elastomers Piezoelectric?

Frank Nüesch, Francis Owusu

Piezoelectrics play a significant role in modern electronics and electric devices. Thermal or mechanical stress on such materials induces a change in polarization generating an electric response, which is the sole effect of why they are so interesting. How ...

Wiley2023

Printed ecoresorbable temperature sensors for environmental monitoring

Danick Briand, Nicolas Francis Fumeaux, James Alec Pierce Bourely

Electronic waste has become a pressing issue, necessitating sustainable solutions for the disposal of electronic devices. While the development of environmentally degradable electronics has gained attention, the fabrication of stable and performant sensors ...

2023

A new versatile hybrid MEMS technology for high sensitivity, fluid proof sensing applications

Matthias Neuenschwander

The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...

EPFL2022

EMC Impact of Disturbances Generated by Multiple Sources

Farhad Rachidi-Haeri, Marcos Rubinstein, Hamidreza Karami

In this paper, the impact of an increasing number of arbitrary electrical/electronic devices on the overall radiated emissions is investigated. Understanding and quantifying such an impact are prerequisites to the proper evaluation of electromagnetic compa ...

2022

Cost-Based Decision Support System: A Dynamic Cost Estimation of Key Performance Indicators in Manufacturing

Dimitrios Kyritsis, Foivos Psarommatis Giannakopoulos

An attempt is made to translate five generic key performance indicators (KPIs) into a continuous real-time cost function in a batch order-based manufacturing environment. The challenge of controlling and optimizing resource utilization, production efficien ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

Source Reconstruction Method Using Phase-Less Magnetic Near-Field Measurements: Application of the Method of Moment with Roof-Top Basis Functions

Marcos Rubinstein, Hamidreza Karami

Source reconstruction methods have many applications such as antenna diagnosis, calculating far-field radiated emissions, and identifying incompatible sources on integrated circuits or printed circuit boards. In this paper, the Gerchberg-Saxton algorithm i ...

IEEE2022

Integrated electronic device with embedded microchannels and a method for producing thereof

Elison de Nazareth Matioli, Remco Franciscus Peter van Erp

The present invention relates to a method for fabricating an integrated electronic device with a microchannel, comprising the steps of: - Providing a homogeneous or heterogeneous substrate with one or more layers of material, respectively; - Forming at lea ...

2021

In-situ laser sintering for the fabrication of fully 3D printed electronics composed of elastomeric materials

Danick Briand, Rubaiyet Iftekharul Haque, Sébastien Lani, Ryan Mitchell van Dommelen

In-situ laser sintering can be used to locally sinter conductive inks in an uninterrupted process, enabling the embedding of printed electronics within 3D printed structures. In this work we apply a laser sintering method to create highly conductive silver ...

2021

2D Material Based Inks For Room Temperature Printed Electronics

Sina Abdolhosseinzadeh

Functional printing is a versatile mass production method that has gained considerable scientific and industrial attention in the past few years. A wide range of electronics from passive circuit components (e.g., resistors and interconnects) to high-perfor ...

EPFL2021

An Energy-Autonomous Wireless Sensor With Simultaneous Energy Harvesting and Ambient Light Sensing

Andreas Peter Burg, Catherine Dehollain, Roberto La Rosa

Wireless sensor nodes (WSNs) are generally powered by batteries, which results in a substantial limitation to the places where the nodes can be installed, to the maximum number of deployable devices, and to the node lifetime. To meet the demand for Interne ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2021