Publications associées à High-aspect ratio nanopatterning via combined thermal scanning probe lithography and dry etching

Publications associées (22)

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

Smart Slit Assembly Employing Continuously Tunable MEMS Shutter

Benedikt Guldimann, Niels Quack, Gergely Huszka, Hamed Sattari, Anton Lagosh

We present the concept and detailed design of a Smart Slit Assembly for next generation spectrometers, and we experimentally demonstrate operation of an individual 221 mu m x 111 mu m smart slit channel employing a MEMS actuated shutter to continuously mod ...

SPIE-INT SOC OPTICAL ENGINEERING2021