Publications de Jacques Jacot | EPFL Graph Search

Chattez avec Graph Search

Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.

AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.

In video surveillance and sports analysis applications, object trajectories offer the possibility of extracting rich information on the underlying behavior of the moving targets. To this end we introduce an extension of Point Distribution Models (PDM) to a ...

Vision-based tracking is used in nearly all robotic laboratories for monitoring and extracting of agent positions, orientations, and trajectories. However, there is currently no accepted standard software solution available, so many research groups resort ...

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

Mechanical and electrical connecting of piezoelectric actuator is often done using conductive glue. Its advantage is not to heat the piezoelectric actuator during connection. But there are many disadvantages to gluing; the main one is curing time. Welding is another alternative, but when done in an oven, the temperature needed for this operation might destroy the heat sensitive actuator. The method described in this paper is laser soldering of piezoelectric actuator. The piezo actuator is mechanically and e

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low thermally induced stress on the MEMS during final packaging operation. The package consists of a 10-layer LTCC case with a recessed cavity for the MEMS chip, and glass lid (with antireflection coating and thin-film metallisation for soldering) for optical I

A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base with a glass lid. These two parts are soldered together by the use of a laser diode. The advantages of the laser soldered joint is its hermeticity to water and air in regard to glue and plastic, as well as the possibility to heat only the soldered joint.

Sorting and mating is a very common practice in high precision manufacturing, as well in the watch industry, biomedical or automotive industry. This strategy helps to increase the assembly yield, but is costly and time-consuming. The question is, when is i ...

Technological solutions for obstacle-detection systems have been proposed to prevent accidents in safety-transport applications. In order to avoid the limits of these proposed technologies, an obstacle-detection system utilizing stereo cameras is proposed ...

In recent years, the advent of robust tracking systems has enabled behavioral analysis of individuals based on their trajectories. An analysis method based on a Point Distribution Model (PDM) is presented here. It is an unsupervised modeling of the traject ...

A decision making tool is proposed to evaluate assembly costs of micro-products (< 1 dm(3)) and to compare different assembly strategies for a given product or product family. The tool takes into account equipment costs as well as running costs, for manual ...

Press-fitting is a very common assembly process used in many fields, especially in the watchmaking industry. It consists of introducing a shaft in a hole (also called receptor) with a certain value of tightening (or interference). However, this process is ...

At small sizes, piezoelectric bending actuators are more practical and have more favorable downscaling properties than traditional electromagnets in the field of microfluidics. However, their application is limited by the difficulty of ensuring proper clamping during assembly. Emerging PZT thick-film technologies are promising as they solve the clamping problem, but their performance is still unsatisfactory for most applications. Therefore, the use of bulk PZT benders assembled onto LTCC or alumina by gluin

The sensor, to determine the concentration of glucose in blood, is implanted within an ampoule (1) containing a sensitive liquid. Glucose can penetrate into the ampoule through its cellulose mantle (2), where the viscosity of the liquid and glucose mixture is measured. A portable instrument, placed externally on the skin, controls the measurement and evaluation of the readings. The sensor, to determine the concentration of glucose in blood, is implanted within an ampoule (1) containing a sensitive liquid. G

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...

Jacques Jacot

Chattez avec Graph Search

Trajectory Analysis for Sport and Video Surveillance

SwisTrack - A Flexible Open Source Tracking Software for Multi-Agent Systems

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Laser soldering of piezoelectric actuator with minimal thermal impact

Hermetic package for optical MEMS

Hermetic package for optical MEMS

Laser soldering of LTCC hermetic packages with minimal thermal impact

When manufacturing capability exceeds control capability: The paradox of high precision products, or is it possible to assemble functional products out of components we are unable to measure?

3D Objects Localization Using Fuzzy Approach and Hierarchical Belief Propagation: Application at Level Crossings

Behavioral Analysis of Mobile Robot Trajectories Using a Point Distribution Model

A decision making tool for reconfigurable assembly lines EUPASS project

New designs for submillimetric press-fitting

Assembly of microvalves actuated by PZT bender

Systeme capteur destine a la determination de la glycemie

Laser Sealed Packaging for Microsystems

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Driver alertness sensing

Calibration of an embedded camera for driver-assistant systems

Automated Work Yard by Use of Decentralized Method

Surfaces satinees: Quelques methodes susceptibles de rendre compte de leur aspect