Concept

Encapsulation (électronique)

Publications associées (28)

Rapid identification and interpretation of gene‐environment associations using the new R.SamBada landscape genomics pipeline

Stéphane Joost, Kevin Leempoel, Sylvie Stucki, Estelle Rochat, Oliver Michele Selmoni, Elia Vajana, Solange Catherine Gaillard

Samβada is a genome‐environment association (GEA) software, designed to search for signatures of local adaptation. However, pre‐ and post‐processing of data can be labour‐intensive, preventing wider uptake of the method. We have now developed R.SamBada, an ...

2019

Learning-Based Hardware Design for Data Acquisition Systems

Cosimo Aprile

This multidisciplinary research work aims to investigate the optimized information extraction from signals or data volumes and to develop tailored hardware implementations that trade-off the complexity of data acquisition with that of data processing, conc ...

EPFL2018

System Design and Advanced Circuit Techniques for Bi-Directional Brain-Machine Interfaces

Wen-Yang Hsu

Bi-directional brain-machine interfaces (BBMIs) that can capture electrophysiological signals and provide feedback through electrical stimulation are emerging tools with various applica-tions in fundamental neuroscience research as well as in clinical trea ...

EPFL2018

Cyber-Medical Systems: Requirements, Components and Design Examples

Giovanni De Micheli

Cyber-medical systems will produce a major revolution in health care, by both raising the quality of care and reducing its cost, thus reaching an important social and economic goal. The evolution of electronic devices and systems has already enabled societ ...

2017

Stretchable metallization technologies for skin-like transducers

Hadrien Olivier Michaud

The skin is not only the largest human organ, capable of accomplishing distributed and multimodal sensing functions. Replicating the versatility of skin artificially is a significant challenge, not only in terms of signal processing but also in mechanics. ...

EPFL2017

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Seniz Esra Küçük

Research and development efforts on chip and wafer-scale 3D integration for system miniaturization have been continuing for more than a decade. However, there are still only a handful of 3D integrated products available in the market due to the high cost a ...

EPFL2017

Monolithic perovskite/silicon-heterojunction tandem solar cells processed at low temperature

Michael Graetzel, Mohammad Khaja Nazeeruddin, Ulf Anders Hagfeldt, Michael Saliba, Antonio Abate, Juan-Pablo Correa-Baena, Ludmilla Steier

Tandem solar cells combining silicon and perovskite absorbers have the potential to outperform state-of-the-art high efficiency silicon single junction devices. However, the practical fabrication of monolithic silicon/perovskite tandem solar cells is chall ...

Royal Soc Chemistry2016

Micromechanical resonators with sub-micron gaps filled with high-k dielectrics

Mariazel de la Candelas Maqueda López

Scaled microelectromechanical (MEMS) resonating devices have generated a great interest for their use in RF front-end architectures for wireless communication, channel-select filters, on-chip signal processing and timing and extreme mas sensing application ...

EPFL2017