Dissipateur thermique

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of aluminium or copper. A heat sink transfers thermal energy from a higher-temperature device to a lower-temperature fluid medium. The fluid medium is frequently air, but can also be water, refrigerants or oil. If the fluid medium is water, the heat sink is frequently called a cold plate. In thermodynamics a heat sink is a heat reservoir that can absorb an arbitrary amount of heat without significantly changing temperature. Practical heat sinks for electronic devices must have a temperature higher than the surroundings to transfer heat by convection, radiation, and conduction. The power supplies of electronics are not absolutely efficient, so extra heat is produced that may be detrimental to the function of the device. As such, a heat sink is included in the design to disperse heat.