Mediaspace scheduled maintenance: Aug 25, 2026 07:00 - 12:00 AM. During this time, videos will be temporarily unavailable. Check status updates.

Concept

Matrice de billes

Publications associées (23)

SiGe Time Resolving Pixel Detectors for High Energy Physics and Medical Imaging

Fulvio Martinelli

In the last years, sub-nanosecond time-resolved particle detectors have been object of research by many companies and institutes since they represent an efficient tool to improve the performance of detecting systems for various applications such as High En ...

EPFL2022

Generation of Human iPSC-Derived Neurons on Nanowire Arrays Featuring Varying Lengths, Pitches, and Diameters

Anna Fontcuberta i Morral, Wonjong Kim

Nanowire (NW) arrays interfaced with biological cells have been demonstrated to be potent tools for advanced applications such as sensing, stimulation, or drug delivery. Many implementations, however, have so far only been studied with rather robust basic ...

WILEY2022

Investigation of femtosecond laser-enabled 3D micro-infiltration processes

Enrico Casamenti

In the last decades, the femtosecond laser micromachining of glass has attracted a lot of attention due to its three-dimensional manufacturing ability and flexibility both in terms of compatible substrates and modification types. Yet, to fully unravel its ...

EPFL2022

Characterization and Modeling of Mismatch in Cryo-CMOS

Edoardo Charbon

This paper presents a device matching study of a commercial 40-nm bulk CMOS technology operated at cryogenic temperatures. Transistor pairs and linear arrays, optimized for device matching, were characterized over the temperature range from 300 K down to 4 ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2020

Gallium-Based Thin Films for Wearable Sensors and Electronic Skins

Laurent Mirko Dejace

Integrated wearable electronics capable of providing biophysical information on complex and dynamic systems have attracted high interest in diverse fields such as healthcare, gaming and robotics. Wearable sensors can create artificial, electronic skins wit ...

EPFL2020

Robust optimization of power grid with distributed generation and improved reliability

Amarasinghage Tharindu Dasun Perera, Zhengchao Wang

Uncertainties of demand, generation and component outage can lead to black-outs in the grid. This study proposes an optimization algorithm (based on Benders Decomposition (BD)) to optimize a Power Transmission System (PTS) that is robust to aforementioned ...

ELSEVIER SCIENCE BV2019

Spatial coherence properties of an LED-based illumination system for mask-aligner lithography

Hans Peter Herzig, Toralf Scharf, Wilfried Noell, Raoul Kirner, Johana Bernasconi

A high-power LED-based illumination system has been developed as a replacement for the mercury arc lamps used in mask-aligner lithography. LEDs are arranged in a grid array and placed in the entrance aperture of individual reflectors. Those reflectors decr ...

SPIE2019

Gravure printed Ag/conductive polymer electrodes and simulation of their electrical properties

Frank Nüesch, Jakob Heier, René Uwe Schneider

In this paper, some practical issues related to the manufacturing, and design criteria related to the application in devices of a hybrid silver grid/poly (3,4-ethylenedioxythiophene) semi-transparent electrode are discussed. The electrodes are fabricated b ...

SPRINGER LONDON LTD2019

Monolithic SPAD Arrays for High-Performance, Time-Resolved Single-Photon Imaging

Edoardo Charbon, Claudio Bruschini, Ivan Michel Antolovic, Samuel Burri, Arin Can Ülkü, Chunmin Zhang, Scott Anthony Lindner

SPAD (single-photon avalanche diode) arrays are single-photon sensors, which enable photon counting and unparalleled time-resolved imaging. In this paper, we will detail the architecture and characteristics of three representative SPAD arrays, implemented ...

IEEE2018

A Compact Modular Soft Surface With Reconfigurable Shape and Stiffness

Jamie Paik, Matthew Aaron Robertson, Wyatt Marshall Felt

A variety of reconfigurable surface devices, utilizing large numbers of actuated physical pixels to produce discretized 3D contours, have been developed for different purposes in research and industry. The difficulty of integrating many actuators in close ...

2018

Organoid arrays

Matthias Lütolf, Nathalie Brandenberg

The invention provides methods for producing arrays of organoids, the arrays thereof and uses of such arrays. ...

2018

Storage method and apparatus for random access memory using codeword storage

Harm Cronie

A memory circuit, such as an embedded DRAM array, stores information as groups of bits or data using information coding in storage and retrieval data, instead of each bit being stored separately. Write data words can be mapped to storage format words that ...

2016

LinoSPAD: a time-resolved 256x1 CMOS SPAD line sensor system featuring 64 FPGA-based TDC channels running at up to 8.5 giga-events per second

Edoardo Charbon, Claudio Bruschini, Samuel Burri

LinoSPAD is a reconfigurable camera sensor with a 256x 1 CMOS SPAD (single-photon avalanche diode) pixel array connected to a low cost Xilinx Spartan 6 FPGA. The LinoSPAD sensor's line of pixels has a pitch of 24 pm and 40% fill factor. The FPGA implements ...

Spie-Int Soc Optical Engineering2016

A compact, integrated silicon device for the generation of spectrally filtered, pair-correlated photons

Vincenzo Savona, Momchil Minkov

The third-order nonlinearity of silicon gives rise to a spontaneous four-wave mixing process in which correlated photon pairs are generated. Sources based on this effect can be used for quantum computation and cryptography, and can in principle be integrat ...

Iop Publishing Ltd2016

High-resolution, large-area fabrication of compliant electrodes via laser ablation for robust, stretchable dielectric elastomer actuators and sensors

Herbert Shea, Samuel Rosset, Oluwaseun Adelowo Araromi

A key element in stretchable actuators, sensors and systems based on elastomer materials are compliant electrodes. While there exist many methodologies for fabricating electrodes on dielectric elastomers, very few succeed in achieve high-resolution pattern ...

Amer Chemical Soc2015

Wafer-fused VECSELs emitting in the 1310 nm waveband

Elyahou Kapon, Alexandru Mereuta, Alexei Sirbu, Vladimir Iakovlev, Andrei Caliman, Nicolas Volet, Kamil Pawel Pierscinski

Optically pumped wafer fused 1310 nm VECSELs have the advantage of high output power and wavelength agility. Gain mirrors in these lasers are formed by direct bonding of InAlGaAs/InP active cavities to Al(Ga) As/GaAs DBRs. We present for the first time Wat ...

Spie-Int Soc Optical Engineering2014

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Yusuf Leblebici, John Richard Thome, Michail Zervas, Yassir Madhour

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Thermal Simulation of Liquid-Cooled Integrated Circuits

Arvind Raj Mahankali Sridhar

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013

A Passive Louver-Based Daylighting System

Marilyne Andersen

A daylighting system for use in a building including a louver array having a first longitudinal element, and a second longitudinal element spaced therefrom. At least one of the first and second elements has an asymmetrical profile, each of the first and se ...

United States Patent and Trademark Office (USPTO)2013

Fabrication and characterization of wafer-level deep TSV arrays

Yusuf Leblebici, Michail Zervas, Yüksel Temiz

Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...

IEEE2012