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Publications associées (30)

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A Novel Reconfigurable CMOS Compatible Ka Band Bandstop Structure Using Split-Ring Resonators and Vanadium Dioxide (VO2) Phase Change Switches

Mihai Adrian Ionescu, Andreas Schueler, Anna Krammer, Emanuele Andrea Casu, Andrei Müller, Junrui Zhang, Riyaz Mohammed Abdul Khadar

The article presents the design, fabrication and characterization of a novel complementary metal-oxidesemiconductor (CMOS) compatible reconfigurable Ka band bandstop structure using split ring resonators (SRR) while employing the Vanadium Dioxide (VO2) pha ...

IEEE2019

Experimental Characterization of Different Condenser Technologies in a Passive Two-Phase Cooling System for Thermal Management of Electronics

John Richard Thome, Jackson Braz Marcinichen, Raffaele Luca Amalfi, Chiara Falsetti

Passive two-phase, micro-channel cooling for thermal management of electronics represents an efficient and viable solution to augment conventional air-cooling systems with the potential for higher power dissipation densities, increased reliability, reduced ...

IEEE2019

Exergoeconomic optimization of a solar driven system with reverse osmosis desalination unit and phase change material thermal energy storages

Hossein Pourrahmani

The goal of the current article is to suggest a novel solar system to produce power, fresh water, and cooling. As solar energy is unavailable at nights, a novel thermal storage system (TES) based on phase change material (PCM) is used to store the required ...

Elsevier2019

Characterization of variable stiffness joints for adaptive structures

Gennaro Senatore

This paper presents a new strategy to control the structure dynamic response via a shift of the natural frequencies obtained through using variable stiffness joints. The joints are made of shape memory polymers and are fabricated through 3D printing. Stiff ...

Taylor & Francis2019

Volume change characteristics of fine-grained soils due to sequential thermo-mechanical stresses

Alessio Ferrari

Know-how of volume change characteristics, VCC, of the fine-grained soils, exposed to thermal stresses, is essential for design of various thermo-active structures. These stresses are known to induce excess pore-water pressure, Δu θ , in the saturated stat ...

2019

Experimental characterisation of the thermohydraulic performance of a micro-pin fin evaporator: Heat transfer, flow visualization and modelling

Chiara Falsetti

The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integra ...

EPFL2018

Thermal Interface Material Enablement of Off-Board Two-Phase Cooling

John Richard Thome, Raffaele Luca Amalfi

Two-phase, refrigerant-based cooling offers significant promise for increasing heat densities and energy efficiencies of electronic components. One barrier to wide spread adoption of two-phase cooling solutions is preserving product features deemed essenti ...

IEEE2018

Optimized pcm-based heat exchanger for infant incubator

Véronique Michaud, Florian Dujonc, Matthieu Gani

The invention relates to a PCM-based heat exchanger (1) exploiting the characteristics of a phase change material (PCM), comprising a base (100); a metallic heat exchanger (101) adapted to be included into the base (100) and having a plurality of hollow vo ...

2017

Role Of A Liquid Accumulator In A Passive Two-Phase Liquid Cooling System For Electronics: Experimental Analysis

John Richard Thome, Jackson Braz Marcinichen, Raffaele Luca Amalfi, Nicolas Lamaison

Gravity-driven two-phase liquid cooling systems using flow boiling within micro-scale evaporators are becoming a game changing solution for electronics cooling. The optimization of the system's filling ratio can however become a challenging problem for a s ...

Amer Soc Mechanical Engineers2017

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

John Richard Thome, Mirco Magnini, Chiara Falsetti

The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase coolin ...

Asme2017