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Concept

PCI Express

Publications associées (24)

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Giovanni De Micheli, Luca Benini

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015

Multiple Independent Gate FETs: How Many Gates Do We Need?

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Luca Gaetano Amarù, Subhasish Mitra

Multiple Independent Gate Field Effect Transistors (MIGFETs) are expected to push FET technology further into the semiconductor roadmap. In a MIGFET, supplementary gates either provide (i) enhanced conduction properties or (ii) more intelligent sw ...

IEEE2015

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Giulia Beanato

3D-ICs based on TSV technology provide high bandwidth inter-chip connections. The drawback is that most of the existing TSVs consume a large amount of silicon real estate. We present circuit-level design and analysis of area efficient, low power, high-data ...

2014

Energy Efficient VLSI Circuits for MIMO-WLAN

Carl Christian Sten Dominic Senning

Mobile communication - anytime, anywhere access to data and communication services - has been continuously increasing since the operation of the first wireless communication link by Guglielmo Marconi. The demand for higher data rates, despite the limited b ...

EPFL2014