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Catégorie

Logistique

Publications associées (7)

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Wenjing Sun

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Alain Yuji Takabayashi, Hamed Sattari

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An analysis of destination choice for opaque airline products using multidimensional binary logit models

Michel Bierlaire

We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...

Pergamon-Elsevier Science Ltd2012

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Thomas Maeder, Jacques Jacot

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006