Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Color filter arrayIn digital imaging, a color filter array (CFA), or color filter mosaic (CFM), is a mosaic of tiny color filters placed over the pixel sensors of an to capture color information. The term is also used in reference to e paper devices where it means a mosaic of tiny color filters placed over the grey scale display panel to reproduce color images. Color filters are needed because the typical photosensors detect light intensity with little or no wavelength specificity and therefore cannot separate color information.
